LASER CUTTING METHOD OF FRAGILE MATERIAL

Title:

LASER CUTTING METHOD OF FRAGILE MATERIAL

Document Type and Number:

WIPO Patent Application WO/2004/087390

Kind Code:

A1

Abstract:

A laser cutting method and a laser cutting apparatus for cutting a fragile material efficiently in which a cut is made in the surface of the fragile material at the time of cutting the fragile material by irradiating it with a laser beam, and then the surface of the fragile material is scanned with the laser beam in the cutting direction starting at the cut thus cutting the fragile material.

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Inventors:

MATSUSHITA NAOHISA (JP)

Application Number:

PCT/JP2003/004100

Publication Date:

October 14, 2004

Filing Date:

March 31, 2003

Export Citation:

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Assignee:

FUJITSU LTD (JP)
MATSUSHITA NAOHISA (JP)

International Classes:

B23K26/067; B23K26/40; B28D1/22; B28D5/00; H01L21/78; (IPC1-7): B28D5/00

Foreign References:

JP2001176820A	2001-06-29
JP2003002676A	2003-01-08
JPH09155851A	1997-06-17
JPH1154885A	1999-02-26
JP2002154846A	2002-05-28

Attorney, Agent or Firm:

Toyama, Tsutomu (4-10 Higashi Nihonbashi 3-chom, Chuo-ku Tokyo, JP)

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