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Title:
LASER IRRADIATION DEVICE AND LASER IRRADIATION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/138674
Kind Code:
A1
Abstract:
Provided are a laser irradiation device and a laser irradiation method with which energy required for irradiating laser light can be suppressed when predetermined regions on a substrate are laser-annealed. A laser irradiation device according to an embodiment of the present invention is characterized by being provided with: a light source that generates laser light; and a laser head including cylindrical lenses that receive the laser light and generate parallel thin-line laser beams in the movement direction of the substrate, wherein the laser head irradiates, with the thin-line laser beams, predetermined regions of the substrate covered by an amorphous silicon thin-film, to form polysilicon thin-films in the predetermined regions.

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Inventors:
MIZUMURA MICHINOBU (JP)
Application Number:
PCT/JP2018/041566
Publication Date:
July 18, 2019
Filing Date:
November 08, 2018
Export Citation:
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Assignee:
V TECH CO LTD (JP)
International Classes:
H01L21/20; H01L21/268; H01L21/336; H01L29/786
Foreign References:
JP2008177598A2008-07-31
JP2012243818A2012-12-10
JP2002057105A2002-02-22
JP2005150438A2005-06-09
JP2014016379A2014-01-30
JP2010134068A2010-06-17
Attorney, Agent or Firm:
SHIRASAKA & PATENT PARTNERS (JP)
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