Title:
LASER LIFT-OFF DEVICE AND LASER LIFT-OFF METHOD
Document Type and Number:
WIPO Patent Application WO/2018/074106
Kind Code:
A1
Abstract:
The present invention is a laser lift-off device for radiating laser light from a back surface of a transparent substrate to a sacrificial layer 5 on the substrate surface while moving the substrate and a laser irradiation optical system for radiating the laser light relative to each other, and peeling a layer to be peeled that is formed on the surface of the substrate, the laser irradiation optical system being configured so as to be capable of radiating laser light having a high intensity subsequent to radiating laser light having a low intensity among laser lights having different irradiation intensities to the sacrificial layer 5.
Inventors:
FUJIMORI YUYA (JP)
Application Number:
PCT/JP2017/032916
Publication Date:
April 26, 2018
Filing Date:
September 12, 2017
Export Citation:
Assignee:
V TECH CO LTD (JP)
International Classes:
B23K26/57
Domestic Patent References:
| WO2017110121A1 | 2017-06-29 |
Foreign References:
| JP2006231407A | 2006-09-07 | |||
| JP2010153876A | 2010-07-08 | |||
| JP2011051011A | 2011-03-17 |
Attorney, Agent or Firm:
OGAWA, Moriaki et al. (JP)
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