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Patent Searching and Data


Title:
LASER MACHINING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2008/001808
Kind Code:
A1
Abstract:
Detection of the three-dimensional shape of a work, enhancement of the precision of the focal point position of a machining laser beam, and compaction of a laser beam machining apparatus are realized. The laser beam machining apparatus (10) operates as follows. While a laser beam output section driver (46) is moving a work (12) from a position near a laser beam output section (22) to a far position, the work (12) is sequentially imaged with a camera (34). Best focused point detection data is extracted from pixels in positions corresponding to best focused point detection positions (P1-n) predetermined in the captured images. A best focused point detection waveform (W) based on the variation of the best focused point detection data is formed for each best focused point detection position (P1-n). The peak values (PK) of the best focused detection waveforms (W) in the best focused detection positions (P1-n) determined from the best focused detection waveforms (W) are compared with one another so as to judge the acceptance/rejection of the work (12). If the work is acceptable, the laser beam output section (22) is moved to the best focused position to perform laser beam machining; contrarily if the work is rejected, the laser beam is not emitted.

Inventors:
WATANABE SHINJI (JP)
MATSUDA YOSHIO (JP)
YAMASHITA HIROKI (JP)
Application Number:
PCT/JP2007/062903
Publication Date:
January 03, 2008
Filing Date:
June 27, 2007
Export Citation:
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Assignee:
O M C CO LTD (JP)
WATANABE SHINJI (JP)
MATSUDA YOSHIO (JP)
YAMASHITA HIROKI (JP)
International Classes:
B23K26/00; B23K26/03
Foreign References:
JPS571594A1982-01-06
JPH01107990A1989-04-25
JPH0553786U1993-07-20
JPH1123952A1999-01-29
JP2000263273A2000-09-26
JP2000326085A2000-11-28
JP2002321080A2002-11-05
JP2004066340A2004-03-04
Attorney, Agent or Firm:
MORI, Yoshiaki (Osaka-EkimaeDai-4 Bldg., 11-4, Umeda 1-chome,Kita-ku, Osaka-sh, Osaka 01, JP)
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