Title:
METAL WIRE ROD PLATING INSOLUBLE ANODE AND PRODUCTION METHOD OF WIRE ROD
Document Type and Number:
WIPO Patent Application WO/2008/001807
Kind Code:
A1
Abstract:
A metal wire rod plating insoluble anode which can make uniform a plating deposition
amounts in a plurality of metal wire rods constantly and for an extended period,
can contribute to simplifying a plating facility and to facilitating a wire leading
job, and provides an excellent feature in releasing gas produced due to plating
reaction; and a production method of a wire rod using this. An insoluble anode
for an electroplating device for concurrently electroplating a plurality of
metal wire rods (60) traveling in parallel through plating solution. The electroplating
device comprises a plurality of insoluble electrode plates (20) arranged in
parallel and oppositely so as to hold the wire pass line of each metal wire rod (60)
from the opposite sides, a plurality of conductive contacts (30) sandwiched
between the electrode plates to form an equidistant gap between them, and a plurality
of through bolts (40) for fastening and fixing the plurality of insoluble electrode
plates (20) and conductive contacts (30) in a parallel direction at a plurality
of locations in a wire rod pass line direction.
Inventors:
MURAKAMI KENICHI (JP)
UMEZAKI YUKIHIRO (JP)
UMEZAKI YUKIHIRO (JP)
Application Number:
PCT/JP2007/062894
Publication Date:
January 03, 2008
Filing Date:
June 27, 2007
Export Citation:
Assignee:
BRIDGESTONE CORP (JP)
MURAKAMI KENICHI (JP)
UMEZAKI YUKIHIRO (JP)
MURAKAMI KENICHI (JP)
UMEZAKI YUKIHIRO (JP)
International Classes:
C25D7/06; C25D17/12
Foreign References:
| JP2000192292A | 2000-07-11 | |||
| JPS6150820U | 1986-04-05 |
Attorney, Agent or Firm:
HONDA, Ichiro (Ikeden Building12-5, Shimbashi 2-chom, Minato-ku Tokyo 04, JP)
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