Title:
LASER MACHINING SYSTEM, MACHINING CONDITION INVESTIGATION DEVICE, AND MACHINING CONDITION INVESTIGATION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/261571
Kind Code:
A1
Abstract:
This laser machining system (100) comprises: a laser machining machine (101); a detection unit (15) that detects the machining status of the laser machining machine (101); a trial machining condition generation unit (9) that generates a machining condition structured from one or more control parameters that can be set for the laser machining machine (101); a machining evaluation unit (5) that evaluates the quality of the machining on the basis of the machining status detected by the detection unit (15); a candidate condition generation unit (10) that generates a candidate condition on the basis of the evaluation result from the machining evaluation unit (5) and a machining condition corresponding to said evaluation result, said candidate condition being a candidate for the machining condition that is to be set for the laser machining machine (101); and a tolerance confirmation unit (11) that uses the candidate condition to perform confirmation machining for confirming the machining tolerance, which indicates the robustness of the candidate condition.
Inventors:
NISHIWAKI MOTOAKI (JP)
FUJII KENTA (JP)
ISHIKAWA KYOHEI (JP)
SEGUCHI MASAKI (JP)
MASUI HIDEYUKI (JP)
FUJII KENTA (JP)
ISHIKAWA KYOHEI (JP)
SEGUCHI MASAKI (JP)
MASUI HIDEYUKI (JP)
Application Number:
PCT/JP2019/025958
Publication Date:
December 30, 2020
Filing Date:
June 28, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/00
Foreign References:
| JP2007090352A | 2007-04-12 | |||
| JP2019101680A | 2019-06-24 | |||
| JP2019098453A | 2019-06-24 | |||
| JP2016206085A | 2016-12-08 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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