Title:
LASER PROCESSING APPARATUS AND METHOD
Document Type and Number:
WIPO Patent Application WO/2012/147200
Kind Code:
A1
Abstract:
Provided are a laser processing apparatus and method capable of preventing conversion efficiency deterioration caused by integration of a tandem thin-film silicon solar cell. The laser processing apparatus of the present invention performs a dividing process by casting a laser beam (602) generated by a laser source and a control system (601) onto thin films stacked on a substrate (609) so as to form a scribe ditch (610) and thus to divide thin films. The apparatus comprises a beam shape controlling optical system (603) so that a cross section of the laser beam (602) cast onto the thin films can have a portion protruding forward in the direction of the dividing process.
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Inventors:
MORITA DAIJI (JP)
ECHIZENYA DAISUKE (JP)
OKAMOTO TATSUKI (JP)
YURA SHINSUKE (JP)
KATSURA TOMOTAKA (JP)
NAKAMURA REONA (JP)
ECHIZENYA DAISUKE (JP)
OKAMOTO TATSUKI (JP)
YURA SHINSUKE (JP)
KATSURA TOMOTAKA (JP)
NAKAMURA REONA (JP)
Application Number:
PCT/JP2011/060432
Publication Date:
November 01, 2012
Filing Date:
April 28, 2011
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
MORITA DAIJI (JP)
ECHIZENYA DAISUKE (JP)
OKAMOTO TATSUKI (JP)
YURA SHINSUKE (JP)
KATSURA TOMOTAKA (JP)
NAKAMURA REONA (JP)
MORITA DAIJI (JP)
ECHIZENYA DAISUKE (JP)
OKAMOTO TATSUKI (JP)
YURA SHINSUKE (JP)
KATSURA TOMOTAKA (JP)
NAKAMURA REONA (JP)
International Classes:
H01L31/04; B23K26/073; B23K26/40
Domestic Patent References:
| WO2011027533A1 | 2011-03-10 |
Foreign References:
| JP2004306082A | 2004-11-04 | |||
| JP2007184421A | 2007-07-19 | |||
| JP2002043605A | 2002-02-08 | |||
| JP2002033495A | 2002-01-31 |
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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Claims: