LASER PROCESSING DEVICE, LASER PROCESSING SYSTEM, AND LASER PROCESSING METHOD

WIPO Patent Application WO/2019/198513

A1

A laser processing device provided with: a height measurement unit which measures the vertical direction position of an irradiating point of a processing laser light beam on an upper surface of a substrate; and a control unit which, while causing the irradiating point to be moved over a plurality of division planned lines on the upper surface of the substrate, controls the vertical direction position of a light focusing unit on the basis of the vertical direction position of the irradiating point. The height measurement unit includes a measuring laser oscillation unit which oscillates a measuring laser light beam having a wavelength different from that of the processing laser light beam, and a reflected light receiving unit which receives reflected light of the measuring laser light beam with which the upper surface of the substrate has been irradiated via the same path as that of the processing laser light beam midway therethrough. The control unit, while one of said substrate is being processed by means of the processing laser light beam, modifies the output of the measuring laser oscillation unit on the basis of the intensity of the reflected light received by the reflected light receiving unit.

MORI HIROTOSHI (JP)
KAWAGUCHI YOSHIHIRO (JP)
TANOUE HAYATO (JP)
HISANO KAZUYA (JP)

PCT/JP2019/013293

October 17, 2019

March 27, 2019

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TOKYO ELECTRON LTD (JP)

H01L21/301; B23K26/03; B23K26/364; B23K26/53; G01B11/00

WO2004105110A1

2004-12-02

JP2016139726A	2016-08-04
JP2008119715A	2008-05-29
JP2008119716A	2008-05-29
JP2009297773A	2009-12-24
JP2006278624A	2006-10-12
JP2013021056A	2013-01-31

ITOH, Tadashige et al. (JP)

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