Title:
LASER PROCESSING HEAD AND LASER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/221061
Kind Code:
A1
Abstract:
A laser processing head provided with: a case having a first wall section and a second wall section facing each other in a first direction, a third wall section and a fourth wall section facing each other in a second direction orthogonal to the first direction, and a fifth wall section and a sixth wall section facing each other in a third direction orthogonal to the first direction and the second direction; an incidence part that is arranged on the first wall section or the fifth wall section, and enables laser light to enter the interior of the case; a laser light adjustment part that is arranged inside the case, and that adjusts the laser light entering from the incidence part; and a light-condensing part that is arranged on the sixth wall section, and that condenses and emits to the exterior of the case the laser light adjusted by the laser light adjustment part. The laser light adjustment part has a light axis adjustment part for adjusting the light axis of the laser light entering from the incidence part, the incidence part is offset toward the first wall section in the first direction, and the light-condensing part is offset toward the second wall section in the first direction.
Inventors:
SAKAMOTO TAKESHI (JP)
Application Number:
PCT/JP2021/016817
Publication Date:
November 04, 2021
Filing Date:
April 27, 2021
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/042; B23K26/00
Foreign References:
| JP2014083562A | 2014-05-12 | |||
| JP2012192427A | 2012-10-11 | |||
| JPH04167986A | 1992-06-16 | |||
| JP5456510B2 | 2014-04-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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