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Title:
LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/012195
Kind Code:
A1
Abstract:
A laser processing method according to the present invention is a laser processing method performed by a laser processing apparatus that is provided with a laser light source for emitting laser light and a scanning mechanism for scanning the laser light, the laser processing method including a step for scanning the laser light within an area to be processed (11a). The scanning step includes changing the scanning direction of the laser light multiple times in a direction-changing section in the area to be processed (11a).

Inventors:
USAMI HIRONORI (JP)
FUTAGAMI YOSHIHIRO (JP)
OHTA FUMITAKA (JP)
Application Number:
PCT/JP2017/022337
Publication Date:
January 18, 2018
Filing Date:
June 16, 2017
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
B23K26/082; B23K26/00
Foreign References:
JP2002178157A2002-06-25
JP2004512690A2004-04-22
JP2011173146A2011-09-08
JP2007268576A2007-10-18
JP2011170359A2011-09-01
Other References:
See also references of EP 3486026A4
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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