Title:
LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/090893
Kind Code:
A1
Abstract:
A laser processing method, provided with a laser light emission step for emitting pulse laser light along a line, at an object having a functional element layer on the obverse surface side, from the reverse surface of the object. The laser light irradiation step has: a first step for irradiating the functional element layer with first pulse laser light along the line and forming a weakened region along the line in the functional element layer; and a second step for irradiating the interior of the object with second pulse laser light along the line so as to follow the first pulse laser light, and forming a crack reaching the obverse surface along the line in the object. The pulse width of the first pulse laser light is smaller than the pulse width of the second pulse laser light.
Inventors:
SAKAMOTO TAKESHI (JP)
OKUMA JUNJI (JP)
OKUMA JUNJI (JP)
Application Number:
PCT/JP2019/042588
Publication Date:
May 07, 2020
Filing Date:
October 30, 2019
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L21/301; B23K26/53
Foreign References:
| JP2007012878A | 2007-01-18 | |||
| JP2010284669A | 2010-12-24 | |||
| JP2006140355A | 2006-06-01 | |||
| JP2014120643A | 2014-06-30 | |||
| JP2006339382A | 2006-12-14 | |||
| JP2005019667A | 2005-01-20 | |||
| JP2016187014A | 2016-10-27 | |||
| US20180233410A1 | 2018-08-16 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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