Title:
LASER PROCESSING MONITORING METHOD AND LASER PROCESSING MONITORING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/185973
Kind Code:
A1
Abstract:
This laser processing monitoring device is a monitoring device of a laser processing machine which performs desired laser processing by radiating a laser beam LB onto a given metal workpiece W and melting the workpiece W by means of laser energy, wherein the laser processing monitoring device comprises: a laser oscillator 10; a laser power source 12; a control unit 14; a guide light generating unit 15; transmission optical fibers 16, 17; a head 18 (emitting unit 24, sensor unit 26); an operating panel 20; and a monitoring unit 25. The monitoring unit 25 is a laser monitoring device in a mode of embodiment of the present invention, and is configured to include mainly the control unit 14, the operating panel 20, a sensor signal processing unit 22 and the sensor unit 26, for example.
Inventors:
YANASE ATSUSHI (JP)
NISHIZAKI YUSUKE (JP)
NISHIZAKI YUSUKE (JP)
Application Number:
PCT/JP2017/042882
Publication Date:
October 11, 2018
Filing Date:
November 29, 2017
Export Citation:
Assignee:
AMADA MIYACHI CO LTD (JP)
AMADA HOLDINGS CO LTD (JP)
AMADA HOLDINGS CO LTD (JP)
International Classes:
B23K26/00; B23K26/22
Domestic Patent References:
| WO2013171848A1 | 2013-11-21 | |||
| WO2013153599A1 | 2013-10-17 |
Foreign References:
| JP2017056464A | 2017-03-23 | |||
| JPH106051A | 1998-01-13 | |||
| JP2003320467A | 2003-11-11 | |||
| JP2011240361A | 2011-12-01 |
Attorney, Agent or Firm:
SEISHIN IP PATENT FIRM, P.C. (JP)
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