Title:
LATEX COMPOSITION AND DIP MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/091728
Kind Code:
A1
Abstract:
The present invention provides a latex composition which contains a latex of a conjugated diene polymer and a silicone surfactant that has a silicon atom content of from 1.5% to 10% by weight. The present invention also provides a dip molded body which is obtained by dip molding this latex composition.
Inventors:
KODEMURA JUNJI (JP)
Application Number:
PCT/JP2021/037014
Publication Date:
May 05, 2022
Filing Date:
October 06, 2021
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
B29C41/14; B29C41/36; C08L7/02; C08L9/10; C08L53/02; C08L83/12; B29K9/00; B29L24/00
Foreign References:
| JPS61282478A | 1986-12-12 | |||
| JP2004256615A | 2004-09-16 | |||
| JPH08509134A | 1996-10-01 | |||
| JP2021001253A | 2021-01-07 | |||
| JP2020037635A | 2020-03-12 |
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
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