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Patent Searching and Data


Title:
LAYERED BODY, METHOD FOR PRODUCING SAME, AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/228736
Kind Code:
A1
Abstract:
This layered body comprises, in order, a substrate layer (A), an adhesive layer (B), and a resin layer (D) containing a poly(3-hydroxyalkanoate)-based copolymer (C). The glass transition temperature of the entire resin contained in the adhesive layer (B) is 20°C or greater but less than 90°C. The adhesive layer (B) has a basis weight of 0.1 g/m2 or greater but less than 5.0 g/m2. The resin layer (D) has a thickness of 5 μm to 100 μm.

Inventors:
MURASHIMA KENSUKE
KUSAKABE ITSUKI
FUJITA MASAYUKI
OKADA YASUNORI
Application Number:
PCT/JP2023/017540
Publication Date:
November 30, 2023
Filing Date:
May 10, 2023
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
B32B27/10; B32B27/36
Domestic Patent References:
WO2023068056A12023-04-27
Foreign References:
JP2003011286A2003-01-15
JPH06316042A1994-11-15
JP2012030547A2012-02-16
JPH11504271A1999-04-20
JPH10128920A1998-05-19
Attorney, Agent or Firm:
ARCO PATENT & TRADEMARK ATTORNEYS (JP)
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