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Title:
LAYERED FILM AND COPPER-CLAD LAYERED SHEET
Document Type and Number:
WIPO Patent Application WO/2022/091960
Kind Code:
A1
Abstract:
The present invention provides: a layered film that exhibits excellent heat resistance and dimensional stability in addition to low dielectric properties; and a copper-clad layered sheet in which a copper foil is layered on at least one primary surface of the layered film.　This layered film includes at least one crosslinked polyolefin layer and at least one polyimide resin layer. The crosslinked polyolefin layer comprises a crosslinked product of a graft-modified polyolefin composition containing a graft-modified polyolefin (A) and a crosslinking agent (B). A polar group is introduced into the graft-modified polyolefin (A) by graft modification.

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Inventors:
IMAMURA YUICHI (JP)
KIDO MASAYOSHI (JP)
AKINAGA TAKAHIRO (JP)
Application Number:
PCT/JP2021/039067
Publication Date:
May 05, 2022
Filing Date:
October 22, 2021
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
B32B27/32; C08F255/00; C08L51/06; H05K1/03
Domestic Patent References:
WO2018030026A12018-02-15
Foreign References:
JP2020164870A2020-10-08
JPH09161550A1997-06-20
JP2011148156A2011-08-04
JPH0563321A1993-03-12
Attorney, Agent or Firm:
NIIYAMA Yuichi et al. (JP)
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