Title:
LAYERED PRODUCT FOR BONDING, METHOD FOR BONDING TWO ADHERENDS, AND METHOD FOR PRODUCING BONDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/189667
Kind Code:
A1
Abstract:
The present invention relates to: a layered product for bonding which comprises, in the following order, a molecular-adhesive layer comprising a specific molecular adhesive (M), a first thermoplastic resin layer, which comprises a specific thermoplastic resin, and a second thermoplastic resin layer, the molecular-adhesive layer and the second thermoplastic resin layer serving as the outermost layers at the time of use, wherein, when the heat-sealable temperature of the first thermoplastic resin layer is expressed by Th1 and that of the second thermoplastic resin layer is expressed by Th2, then Th1>Th2; a method for bonding two adherends with this layered product for bonding; and a method for producing a bonded structure. Use of the layered product for bonding of the present invention makes it possible to conduct a thermal fusion-bonding step without adversely affecting the molecular-adhesive layer.
Inventors:
UEMURA KAZUE (JP)
MIYATA SOU (JP)
MIYATA SOU (JP)
Application Number:
PCT/JP2019/013809
Publication Date:
October 03, 2019
Filing Date:
March 28, 2019
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/35; B29C65/02; B29C65/52; B32B27/00; C09J5/06; C09J7/22; C09J7/29; C09J201/02; C09J201/10
Domestic Patent References:
| WO2007029541A1 | 2007-03-15 |
Foreign References:
| JPH1148423A | 1999-02-23 | |||
| JP2008050541A | 2008-03-06 |
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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