Title:
LAYERED STRUCTURE, CURED PRODUCT OF RESIN LAYER IN SAID LAYERED STRUCTURE, AND ELECTRONIC COMPONENT HAVING SAID CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/238732
Kind Code:
A1
Abstract:
[Problem] To provide a layered structure that includes a resin layer with which a cured product with a high dielectric constant can be obtained and having both good image formation after development and before heat curing and good image formation after heat curing, and that has both good detachability and good adhesion between the resin layer and a second film. [Solution] This layered structure comprises a first film, a resin layer, and a second film, in that order. The resin layer contains a carboxyl group-containing resin (A), a photo-curable compound (B) containing no carboxyl group, a photoinitiator (C), a perovskite-type compound (D), and an epoxy resin (E). In terms of solid content, the content of the perovskite-type compound (D) accounts for 55-85 mass% of the entire mass of the resin layer. The epoxy resin (E) includes a solid epoxy resin and a liquid epoxy resin. In terms of solid content, the content of the liquid epoxy resin is 150-1000 parts by mass per 100 parts by mass of the solid epoxy resin.
Inventors:
SASAKI MASAKI (JP)
SAITO SAKI (JP)
SAITO SAKI (JP)
Application Number:
PCT/JP2023/020028
Publication Date:
December 14, 2023
Filing Date:
May 30, 2023
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
B32B27/38; B32B27/18; C08F2/44; C08L63/00; C08L101/08; G03F7/027
Domestic Patent References:
| WO2017122460A1 | 2017-07-20 |
Foreign References:
| JP2020154325A | 2020-09-24 | |||
| JP2020154052A | 2020-09-24 | |||
| JP2022028036A | 2022-02-14 | |||
| JP2017037287A | 2017-02-16 |
Attorney, Agent or Firm:
ETOH Toshiaki et al. (JP)
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