Title:
LAYERED STRUCTURE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/238548
Kind Code:
A1
Abstract:
Provided is a layered structure that can be manufactured without the use of a chemical having a powerful oxidizing effect, the layered structure having high adhesion between a resin base material and a metal layer. A layered structure (10) comprises: a resin base material (20); a barrier film (30) positioned on the resin base material (20) and including a first metal element; and a metal layer (40) positioned on the barrier film (30) and including a second metal element, wherein a portion of the metal layer (40) passes through the barrier film (30) and extends up to the interior of the resin base material (20).
Inventors:
ARAKAWA YUSUKE (JP)
NAMBA RYOTARO (JP)
NAMBA RYOTARO (JP)
Application Number:
PCT/JP2023/016624
Publication Date:
December 14, 2023
Filing Date:
April 27, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B32B15/08; C23C26/00
Domestic Patent References:
| WO2007020726A1 | 2007-02-22 | |||
| WO2007029440A1 | 2007-03-15 |
Foreign References:
| JP2006028558A | 2006-02-02 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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