Title:
LEAD FRAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Document Type and Number:
WIPO Patent Application WO/2013/081306
Kind Code:
A1
Abstract:
A lead frame and a semiconductor package including the lead frame. The lead frame includes, a base material, a first metal layer formed on at least a surface of the base material by using copper, and a second metal layer formed of an alloy including at least silver (Ag), and palladium (Pd) on a surface of the first metal layer.
Inventors:
PAEK SUNG-KWAN (KR)
SHIN DONG-IL (KR)
PARK SE-CHUEL (KR)
SHIN DONG-IL (KR)
PARK SE-CHUEL (KR)
Application Number:
PCT/KR2012/009087
Publication Date:
June 06, 2013
Filing Date:
November 01, 2012
Export Citation:
Assignee:
SAMSUNG TECHWIN CO LTD (KR)
PAEK SUNG-KWAN (KR)
SHIN DONG-IL (KR)
PARK SE-CHUEL (KR)
PAEK SUNG-KWAN (KR)
SHIN DONG-IL (KR)
PARK SE-CHUEL (KR)
International Classes:
H01L23/495; H01L21/60
Foreign References:
| EP0380176A1 | 1990-08-01 | |||
| KR20090043907A | 2009-05-07 | |||
| KR19980074509A | 1998-11-05 | |||
| JP2006344925A | 2006-12-21 |
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (13 Eonju-ro 30-gil Gangnam-gu, Seoul 135-971, KR)
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