Title:
LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2013/089376
Kind Code:
A1
Abstract:
The present invention provides a lead frame having excellent solder wettability and solderability, that is well-bonded to a copper wire, and manufactured with low cost, and a semiconductor package manufactured by using the same. The lead frame includes: a base material; a first metal layer formed on at least one surface of the base material, the first metal layer comprising nickel; a second metal layer formed on a surface of the first metal layer, the second metal layer comprising palladium; and a third metal layer formed on a surface of the second metal layer, the third metal layer comprising silver.
Inventors:
PAEK SUNG-KWAN (KR)
SHIN DONG-IL (KR)
PARK SE-CHUEL (KR)
SHIN DONG-IL (KR)
PARK SE-CHUEL (KR)
Application Number:
PCT/KR2012/010368
Publication Date:
June 20, 2013
Filing Date:
December 03, 2012
Export Citation:
Assignee:
SAMSUNG TECHWIN CO LTD (KR)
International Classes:
H01L23/495
Foreign References:
| KR20020045360A | 2002-06-19 | |||
| JP2011228589A | 2011-11-10 | |||
| KR20100103015A | 2010-09-27 | |||
| KR20100028791A | 2010-03-15 |
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (13 Eonju-ro 30-gil,Gangnam-gu, Seoul 135-971, KR)
Download PDF:
Claims: