LEAD-FREE GLASS, COMPOSITION FOR ELECTRONIC CIRCUIT SUBSTRATE AND ELECTRONIC CIRCUIT SUBSTRATE

Title:

LEAD-FREE GLASS, COMPOSITION FOR ELECTRONIC CIRCUIT SUBSTRATE AND ELECTRONIC CIRCUIT SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2004/071982

Kind Code:

A1

Abstract:

A lead-free glass having a chemical composition, in mole %: SiO₂: 68 to 72 %, B₂O₃: 19 to 22.5 %, Al₂O₃: 3 to 7 %, CaO: 0 to 2.5 %, SrO 1 to 6 %, with the proviso that CaO + SrO: 2 to 6 %; and a composition for an electronic circuit substrate comprising, in wt %, 40 to 100 % of a powder of the above lead-free glass and 0 to 60 % of a ceramic filler.

Inventors:

ONODA HITOSHI (JP)
USUI HIROSHI (JP)

Application Number:

PCT/JP2003/016105

Publication Date:

August 26, 2004

Filing Date:

December 16, 2003

Export Citation:

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Assignee:

ASAHI GLASS CO LTD (JP)
ONODA HITOSHI (JP)
USUI HIROSHI (JP)

International Classes:

C04B35/16; C03C3/091; C03C14/00; H05K1/03; (IPC1-7): C03C3/091; C04B35/18; H05K1/03

Foreign References:

JPS6451345A	1989-02-27
JP2001348247A	2001-12-18
JP2002220256A	2002-08-09
US5747396A	1998-05-05

Attorney, Agent or Firm:

Senmyo, Kenji (38 Kanda-Higashimatsushitach, Chiyoda-ku Tokyo, JP)

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