Title:
LEAD-FREE SOLDER ALLOY, SOLDER PASTE, ELECTRONIC CIRCUIT-MOUNTED SUBSTRATE, AND ELECTRONIC CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/031361
Kind Code:
A1
Abstract:
The invention of the present application addresses the problem of providing a lead-free solder alloy, which does not undergo the occurrence of cracking at a solder joint part even under such a severe environment (-40°C to 150°C) where the difference in temperature between a warm condition and a cold one is intense and vibrations are applied, the occurrence of a lift-off phenomenon upon the formation of through-holes and the occurrence of the formation of voids upon the solder joining, and which can be melted satisfactorily even when the peak temperature at soldering is adjusted to about 230°C.
The lead-free solder alloy according to the invention of the present application contains 2 to 4% by mass inclusive of Ag, 0.1 to 0.5% by mass inclusive of Cu, 1 to 3% by mass inclusive of Sb, 2 to 3% by mass inclusive of In, 0.01 to 0.05% by mass inclusive of Ni and 0.001 to 0.015% by mass inclusive of Co, with the remainder made up by Sn.
Inventors:
ARAI MASAYA (JP)
NAKANO TAKESHI (JP)
MUNEKAWA YURIKA (JP)
SHIMAZAKI TAKANORI (JP)
KATSUYAMA TSUKASA (JP)
NAKANO TAKESHI (JP)
MUNEKAWA YURIKA (JP)
SHIMAZAKI TAKANORI (JP)
KATSUYAMA TSUKASA (JP)
Application Number:
PCT/JP2018/030005
Publication Date:
February 13, 2020
Filing Date:
August 09, 2018
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
International Classes:
B23K35/26; C22C13/00; C22C13/02
Foreign References:
| JP2017170465A | 2017-09-28 | |||
| JP2013252548A | 2013-12-19 | |||
| JP2016179498A | 2016-10-13 | |||
| JP2012106280A | 2012-06-07 |
Attorney, Agent or Firm:
OTA Yoko (JP)
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