Title:
LEAD-FREE SOLDER PASTE, ELECTRONIC CIRCUIT BOARD USING LEAD-FREE SOLDER PASTE, AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2008/056676
Kind Code:
A1
Abstract:
Disclosed is a lead-free solder paste composed of a solder powder and a flux (13) mixed
with the solder powder. The solder powder is composed of a first base alloy powder
(11) which is a first alloy in a powder form, and a second base alloy powder (12)
which is a second alloy in a powder form having a component composition different from
that of the first base alloy powder (11). The solder powder has two or more melting
points.
Inventors:
NAKAJIMA SHINSAKU
IRISAWA ATSUSHI
IRISAWA ATSUSHI
Application Number:
PCT/JP2007/071574
Publication Date:
May 15, 2008
Filing Date:
November 06, 2007
Export Citation:
Assignee:
VICTOR COMPANY OF JAPAN (JP)
KOKI KK (JP)
NAKAJIMA SHINSAKU
IRISAWA ATSUSHI
KOKI KK (JP)
NAKAJIMA SHINSAKU
IRISAWA ATSUSHI
International Classes:
B23K35/26; B23K1/00; C22C12/00; C22C13/02; H05K3/34; B23K101/42
Foreign References:
| JPH11347784A | 1999-12-21 | |||
| JPH11186712A | 1999-07-09 | |||
| JP2004009106A | 2004-01-15 | |||
| JPH09295182A | 1997-11-18 | |||
| JPH1052791A | 1998-02-24 | |||
| JP2004017093A | 2004-01-22 | |||
| JP2000141079A | 2000-05-23 | |||
| JPH08252688A | 1996-10-01 |
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (2-8 Toranomon 1-chom, Minato-ku Tokyo 01, JP)
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