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Title:
LEAD WIRE INSERTING METHOD AND HOLDING DEVICE FOR IMPLEMENTING SAME
Document Type and Number:
WIPO Patent Application WO/2018/225777
Kind Code:
A1
Abstract:
A lead wire inserting method for inserting a lead wire of a lead wire-attached electronic component E into a through-hole 98 provided in a wiring board 90 is provided with a third step of mounting a jig 80 on the wiring board 90 so that a side surface on one side of the jig 80 opposes another electronic component E', and so that a bottom surface-side end portion of an inner wall of a guide hole 88 of the jig 80 is placed over the through-hole 98 provided in the wiring board 90. The lead wire inserting method is characterized in that the guide hole 88 has a cross sectional area becoming smaller from a top surface toward a bottom surface, and is provided so as to be open on the side surface on one side of the jig 80.

Inventors:
HASHIMOTO YASUHIKO
BANDO KENJI
KIMURA TOSHIMITSU
Application Number:
PCT/JP2018/021680
Publication Date:
December 13, 2018
Filing Date:
June 06, 2018
Export Citation:
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Assignee:
KAWASAKI HEAVY IND LTD (JP)
International Classes:
H05K13/04; B25J13/00; H05K13/08
Domestic Patent References:
WO2017090243A12017-06-01
WO2017090235A12017-06-01
Foreign References:
JPH0715188A1995-01-17
JP2015095574A2015-05-18
JPS551196A1980-01-07
JPS6139000U1986-03-11
JPH06249629A1994-09-09
JPS57211294A1982-12-25
EP0669682A21995-08-30
JP2002198696A2002-07-12
JP2000094238A2000-04-04
Attorney, Agent or Firm:
PATENT CORPORATE BODY ARCO PATENT OFFICE (JP)
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