Title:
LEAD, WIRING MEMBER, PACKAGE COMPONENT, METAL COMPONENT WITH RESIN, RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHODS FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2010/052856
Kind Code:
A1
Abstract:
A semiconductor device having a lead that is resin-molded, wherein resin burrs can be easily removed without damaging a resin body covering the lead.
A semiconductor device (10), wherein a lead (11) is composed of a metal thin plate, the outer surface of which is covered with a metal coating film, and a semiconductor element (12) is mounted onto the lead (11). A peripheral portion (15) of the lead (11) is covered with a coating film containing a purine skeleton. The coating film is formed by having functional organic molecules self-assembled onto the lead (11), said functional organic molecules being each composed of a purine skeleton which has, at an end, a functional group that is linkable to a metal.
Inventors:
FUKUNAGA TAKAHIRO
Application Number:
PCT/JP2009/005708
Publication Date:
May 14, 2010
Filing Date:
October 28, 2009
Export Citation:
Assignee:
PANASONIC CORP (JP)
FUKUNAGA TAKAHIRO
FUKUNAGA TAKAHIRO
International Classes:
H01L21/60; H01L23/50; H01L23/28
Foreign References:
| JP2008109061A | 2008-05-08 | |||
| JP2002086613A | 2002-03-26 | |||
| JP2003114540A | 2003-04-18 |
Attorney, Agent or Firm:
NAKAJIMA, Shiro et al. (JP)
Shiro Nakajima (JP)
Shiro Nakajima (JP)
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