LED CHIP ASSEMBLY AND MANUFACTURING METHOD THEREFOR, CHIP TRANSFER METHOD, AND DISPLAY BACKPLANE - CHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD

Title:

LED CHIP ASSEMBLY AND MANUFACTURING METHOD THEREFOR, CHIP TRANSFER METHOD, AND DISPLAY BACKPLANE

Document Type and Number:

WIPO Patent Application WO/2023/178637

Kind Code:

A1

Abstract:

The present application relates to an LED chip assembly and a manufacturing method therefor, a chip transfer method, and a display backplane. A manufactured LED chip assembly comprises: a bearing substrate; a bonding layer and several micro LED chips, which are sequentially arranged on the bearing substrate; sacrificial layer units, which are arranged between the micro LED chips and the bonding layer; and a barrier layer, which is arranged on the bonding layer and covers the sacrificial layer units.

Inventors:

WANG TAO (CN)
FENG ZHONGSHAN (CN)

Application Number:

PCT/CN2022/082961

Publication Date:

September 28, 2023

Filing Date:

March 25, 2022

Export Citation:

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Assignee:

CHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD (CN)

International Classes:

H01L33/62; H01L21/683; H01L33/00

Foreign References:

CN112968115A	2021-06-15
CN102903804A	2013-01-30
JP2013004633A	2013-01-07
JP2009152387A	2009-07-09
US20030087476A1	2003-05-08