TECHNICAL FIELD Thepresent invention relates to anLEDmountingmodule, anLEDmodule, amanufacturingmethodofanLEDmountingmodule, and a manufacturing method of an LED module. An LED mounting module includes a substrate and a reflecting member made of a resin. On one ofmain surfaces of the substrate, anLEDdevice istobemounted. Thereflectingmemberhasthereinareflecting hole provided in correspondence with a location, on the main surface ofthe substrate, wheretheLEDdevice istobemounted.

BACKGROUND ART In recent years, light emitting diodes (hereinafter referred to as LEDs) attract attention as a next-generation light source for lighting apparatuses. There is a demand for developingenergy-savinglightingapparatusesusingLEDs, since LEDs have a higher efficiency and a longer lifetime than incandescent andhalogenlamps. Inparticular, withtheirsmall size, LEDs are expected to realize small-sized lighting apparatuses. To use LEDs for lighting apparatuses, a plurality of LED bare chips (hereinafterreferredtoas LEDdevices) aremounted on a substrate, thereby forming an LED module, for example. Here, a reflecting board is provided so as to surround each of the LED devices to improve light extraction efficiency of such an LED module. The reflecting board can collect light from the LED devices. Such a reflecting board can be provided as follows, for example. According to Japanese patent application publication No. 2003-124528 (patent document 1), LED devices are mounted on a substrate, and a reflecting board made of aluminum, a resin or the like is then adhered to the substrate. Here, a phosphor formed by phosphor powders and a resinmaybe provided so as to enclose eachLED device therein, before the reflecting board is adhered. Furthermore, JapanesepatentapplicationpublicationNo. Hll-163412 (patentdocument2) disclosesatechniqueofforming depressions in a substrate, so that part of the substrate functions as a reflecting board. An LEDmodule according to the patent document 1 has the following drawback. An adhesive layer adhering the substrate and the reflecting board absorbs light emitted toward the adhesive layer, out of light emitted by the LED device. In the worst case, the adhesive layer absorbs around 10% of the entire amount of light. This significantly lowers light extraction efficiency. AnLEDmodule accordingto the patent document 2 does not havesuchadrawbackthatanadhesivelayerabsorbs light, since thesubstratehasareflectingsurface formedtherein. However, this LEDmodule has a problemof high cost. In detail, a wiring pattern needs to be formed on an uneven surface, due to the reflecting surface formed in the substrate. This can not be done by a common patterning method.

DISCLOSURE OF THE INVENTION Inlightoftheaboveproblems, anobjectiveofthepresent inventionistoprovideanLEDmountingmodule andanLEDmodule whichcanachievefavorablelightextractionefficiencywithout increasing a cost, and a manufacturing method of such an LED mountingmoduleandamanufacturingmethodofsuchanLEDmodule. TheaboveobjectiveisachievedbyanLEDmountingmodule, comprising: asubstrate; andareflectingmembermadeofaresin materialandhavingareflectingholeinapositioncorresponding to an LED device which is to be mounted on one ofmain surfaces ofthe substrate. Here, the substrate andthe reflectingmember are directly adhered to each other in such a state that the main surface of the substrate is in contact with one of main surfaces-of the reflecting member. Since the substrate and reflecting member are directly adheredto each other in a state that the main surfaces of the substrate and the reflecting member are in contact, nothing is provided between the substrate and the reflecting member (Strictly speaking, minute voids and the like may be found.) . In addition, the substrate and reflecting member are adhered to each other without using an adhesive layer or the like. In other words, the substrate and reflecting member are adhered bymakinguseoftheresinmaterialformingtherefflectingmember. Accordingtothisconstruction, thereflectingmemberand the substrate are directly adhered to each other, without an adhesive layer used in conventional LED mounting modules. Therefore, lightemittedfromanLEDdeviceisnottobeabsorbed by an adhesive layer, thereby preventing a drop in light extraction efficiency. Furthermore, the LED mounting module can be manufactured at a lower cost, than conventional LED mounting modules including^ an adhesive layer. Here, the substrate includes an insulation boardmade of a resinmaterial, and a wiring pattern on one ofmain surfaces of the insulation board, and the resin material forming the insulation board contains a same resin as the resin material forming the reflecting member. Here, the resin material may be a thermosetting resin material or thermoplastic resin material. Accordingto this construction, since the resinmaterial formingtheinsulationboardprincipallycontainsthesameresin as the resin material forming the reflecting member, the insulation board and the reflecting member can be strongly adhered to each other, and have substantially the same linear expansion coefficient. Here, the resin material forming the reflecting member is a thermosetting resin material principally containing an epoxy resin, which is compatible with materials forming other constituentsoftheLEDmountingmodule, andcanbeeasilyhandled. Alternatively, theresinmaterialformingthereflectingmember isathermoplasticresinmaterialprincipallycontainingaresin selected from a group consisting of a polyphthalamide resin, a liquid crystal polymer, a polyphenylene sulfide resin, and apolybutylene terephthalateresin. The resinmaterial forming the reflecting member contains one or more fillers to improve reflection efficiency. Here, thefillersincludeatleastoneofTiO2, SiO2, AL2O3, andBaSO4, and the resinmaterial forming the insulation board contains■at least one of Al2O3, AlN, SiO2, and SiC. Here, ametalboardis provided onthe othermain surface of the substrate. The resin material forming the insulation board is a composite material containing an inorganic fiXler and a thermosetting resin material. Alternatively, the resin material formingthe insulationboardis athermosetting resin material containing a glass fiber. Here, a depression is formed in a part of the substrrate at which the reflecting member is adhered, and the depression isfilledwiththeresinmaterialformingthereflectingmember. Furthermore, theLEDdeviceis one ofapluralityofLEDdevices that are to be mounted on the main surface of the substrate, and the reflecting hole is one of a plurality of reflecting holes formed in the reflecting member in correspondence with the plurality of LED devices. Furthermore, the subst'rate includes an insulationboard made of a ceramicmaterial, and a wiringpattern on one of main surfaces of the insulation board. Here, theceramicmaterial contains atleastone ofAI2O3, AlN, SiO2 , and SiC . The above objective is also achieved by an LED module constitutedbythisLEDmountingmoduleandanLEDdevicemounted on the LED mounting module. The LED device can be directly or indirectly (using a sub-mounting device) mounted on the LED mounting module. According to this construction, the reflecting member and the substrate are directly adhered to each other. This can enhance the extraction efficiency of light emitted by the LED device mounted on the LED mounting module. The above objective is also achieved by a manufacturing method of an LED mounting module including a substrate and a reflecting member having a reflecting hole in a position corresponding to an LED device which is to be mounted on one of main 'surfaces of the substrate. This manufacturing method includes a formation step of forming a half-cured reflecting member formed by a resin material in B stage; and a connection step of placing the half-cured reflecting member on the main surface of the substrate, and completely curing the resin material in B stage while the main surface of the substrate is in contact with a main surface of the half-cured reflecting memberwhichfacesthesubstrate, therebyformingthereflecting member, which is directly adhered to the substrate. Here, a resin material in "B stage" is adhesive because theviscosityoftheresinmaterialhasbeenloweredbyheating. The resinmaterial in "B stage" is completely curedby further heating. According to this manufacturing method, the reflecting member is formed and directly adhered to the substrate by completely curing the resin material in B stage forming the half-cured reflecting member. This indicates that a step of adhering the reflecting member and the substrate is not separatelyrequired, differentlyfromthepriorart. Therefore, the LED mounting module can achieve improved extraction efficiency of light emitted by an LED device which is to be mounted, without increasing a cost. He're, the reflecting member is made of a thermosetting resin material, and in the connection step, the substrate and the half-cured reflecting member are heated and applied with pressure while the main surface of the substrate is in contact with the main surface of the half-cured reflecting member. The above objective is also achieved by a manufacturing method of an LED module. This manufacturing method includes a manufacturing step of manufacturing an LED mountingmodule, based on the manufacturingmethod described above; a mounting step of mounting the LED device at a predetermined location on the manufactured LED mounting module; and a covering step of covering the mounted LED device with a resin material containing a phosphor powder. According to this manufacturing method, the reflecting member is formed and directly adhered to the substrate by completely curing the resin material in B stage forming the half-cured reflecting member. This indicates that a step of adhering the reflecting member and the substrate is not separatelyrequired, differentlyfromthepriorart. Therefore, the LED module can achieve improved extraction efficiency of light emitted by an LED device, without increasing a cost. The above objective is also achieved by a manufacturing method of an LED mounting module. This manufacturing method includes a substrate formation step of forming a substrate; and a reflectingmember formation step of forming a reflecting member on one ofmain surfaces ofthe substrate, the reflecting memberbeingmade of a resinmaterial andhaving a through hole in a position corresponding to an LED device which is to be mounted on the main surface of the substrate. Here, in the reflecting member formation step, the reflecting member is formed in such a manner that a moldingmember is placed on the mainsurfaceofthesubstrate, aliquidresinmaterialisinjected intoaspacedefinedbetweenthemoldingmemberandthesubstrate, and the resin material in the space is cured. According to this manufacturing'method, the reflecting member is formed in such a manner that the molding member is placed on the main surface of the substrate, a liquid resin material is injected into a space defined between the molding member and the substrate, and the resin material in the space is cured. This indicates that a step ofadheringthe reflecting memberandthesubstrateisnotseparatelyrequired, differently fromthepriorart.Therefore, theLEDmountingmodulecanachieve improvedextractionefficiencyoflightemittedbyanLEDdevice which is to be mounted, without increasing a cost. Here, a wiring pattern is formed on the main surface of the substrate, the molding member is formed like a box, and has a protrusion formed on a base in a position corresponding to the LED device which is to be mounted on the main surface of the substrate, when the molding member is placed on the substrate, a toppart oftheprotrusionfaces towardthewiring pattern, adepressionisformedincorrespondencewiththewiring pattern, in the top part of the protrusion, a width of the depression is larger than a width of the wiring pattern, by 1μrato20μm, andaportionofthedepression, whichcorresponds to a portion of the wiring pattern on which the LED device is tobemounted, has adepth largerthanathickness ofthewiring pattern. Here, the liquidresinmaterialis injectedunderreduced pressure, and in the reflecting member formation step, after the resinmaterial inthe space is cured, a surface ofthe cured resinmaterialwhichfacesawayfromthesubstrateisflattened, and flash is removed by spraying"particles against the flash. The above objective is also achieved by a manufacturing method of an LED module. This manufacturing method includes amountingstepofmountinganLEDdeviceononeofmainsurfaces ofasubstrate; andareflectingmemberformationstepofforming a reflecting member on the main surface of the substrate on which the LED device has been mounted, the reflecting member being made of a resin material and having a through hole in a position corresponding to the LED device. Here, in the reflecting member formation' step, the reflecting member is formed in such a manner that a molding member is placed on the mainsurfaceofthesubstrate, aliquidresinmaterialisinjected intoaspacedefinedbetweenthemoldingmemberandthesubstrate, and the resin material in the space is cured. According to this manufacturing method, the reflecting member is formed in such a manner that the molding member is placed on the main surface of the substrate, a liquid resin material is injected into a space defined between the molding member and the substrate, and the resin material in the space is cured. This indicates that a step of adheringthe reflecting memberandthesubstrateisnotseparatelyrequired, differently fromthepriorart. Therefore, theLEDmodulecanachieveimproved extractionefficiencyoflightemittedbyanLEDdevice, without increasing a cost. Here, a wiring pattern is formed on the main surface of the substrate, the molding member is formed like a box, and has a protrusion formed on a base in a position corresponding to the LED device mounted on themain surface of the substrate, when the molding member is placed on the substrate, a top part oftheprotrusion faces towardthewiringpattern, adepression corresponding to the wiring pattern and a depression corresponding to the LED device are formed in the top part of the protrusion, and a width of the depression corresponding tothewiringpatternislargerthanawidthofthewiringpattern, by 1 μm to 20 μm. Here, theliquidresinmaterial is injectedunderreduced pressure, and in the reflecting member formation step, after the resinmaterial inthe space is cured, a surface ofthe cured resinmaterialwhichfacesawayfromthesubstrateisflattened, and flash is removed by spraying particles against the flash.

BRIEF DESCRIPTION OF THE DRAWINGS Fig.1isanoverallviewillustratingalightingapparatus relating to a first embodiment of the present invention. Fig. 2 is a perspective view illustrating an LED module relating to the first embodiment. Fig. 3Ais anenlargedcross-sectionalviewillustrating a part of the LED module in which an LED device is mounted, and Fig. 3B is an enlarged plan view illustrating the part of the LED'module without a lens board. Fig. 4 is aperspectiveviewillustratinganLEDmounting module relating to the first embodiment. Fig. 5Ais an enlargedcross-sectionalviewillustrating a part of the LED mounting module in which an LED device is tobemounted, andFig. 5Bis anenlargedplanviewillustrating the part of the LED mounting module. Fig. 6is usedtoexplainaprintedwiringboardformation step. Fig. 7A is a plan view illustrating a mold, and Fig. 7B is a cross-sectional view illustrating the mold along a line AA shown•in Fig. 7A in a direction shown by the arrows. Fig. 8 is used to explain a half-cured reflecting board formation step. Fig. 9isusedtoexplainanLEDmountingmodule formation step. Fig. 10 is used to explain an LED mounting step. Fig. 11 is used to explain a phosphor formation step. Fig. 12 is used to explain a lens board formation step. Fig. 13A is a cross-sectional view illustrating an LED module relating to a first modification example based on the first embodiment, and Fig. 13B is a cross-sectional view illustrating an LED module relating to a second modification example based on the first embodiment. Fig. 14A is a cross-sectional view illustrating an LED module relating to a third modification example based on the first embodiment, and Fig. 14B is a cross-sectional view illustrating an LED module relating to a fourth modification example based on the first embodiment. ■> Fig. 15 is a schematic cross-sectional view illustrating an LED module relating to a second embodiment. Fig. 16 is used to explain a formation step of a printed wiring board relating to the second embodiment. Fig. 17A is a cross-sectional view illustrating an LED module relating to a fifth modification example based on the second embodiment, and Fig. 17B is a cross-sectional view illustrating an LED module relating to a sixth modification example based on the second embodiment. Fig. 18 is an exploded perspective view illustrating a mold used to form a half-cured reflecting board, in a seventh modification example. Fig. 19A is a cross-sectional view illustrating themold used in the seventh modification example, and Fig. 19B is a planviewillustratingthemoldwithanupperpartbeingremoved. Fig.20isaperspectiveviewillustratinganLEDmounting module relating to an eighth modification example, which includes reflecting pieces instead of a reflecting board. Fig. 21A is a plan view illustrating a mold to form the reflectingpieces relatingtothe eighthmodificationexample, and Fig. 21B is a cross-sectional view illustrating the mold along a line BB shown in Fig. 21A in a direction shown by the arrows. Fig.22isaperspectiveviewillustratinganLEDmounting modulerelatingtoaninthmodificationexample, whichincludes reflecting pieces instead of a reflecting board. Fig. 23A is a plan view illustrating a mold to form the reflecting pieces relating to the ninth modification example, and Fig. 23B is a cross-sectional view illustrating the mold along a line CC shown in Fig. 23A in a direction shown by the arrows. Fig. 24 is a cross-sectional view illustrating an LED module relating to a tenth modification example, where an LED device is indirectly mounted. Fig. 25 is an exploded perspective view illustrating a mold used to form a reflecting board relating to a third embodiment. Fi'g. 26A is a plan view illustrating themold used in the third embodiment, and Fig. 26B is a cross-sectional view illustrating the mold along a line DD shown in Fig. 26A in a direction shown by the arrows. Fig. 27 is used to explain a reflecting board formation step relating to the third embodiment. Fig.28isacross-sectionalviewillustratingdepressions formed in a protrusion of the mold, when the mold is placed on a printed wiring board. Fig. 29 is aplanviewillustrating aprotrusionofamold used in an eleventh modification example. Fig. 3OA is a cross-sectional view illustrating a mold relatingtoa twelfthmodificationexample andaprintedwiring board during a step of forming a reflecting board, and Fig. 3OB is a cross-sectional view illustrating the mold and the printed wiring board along a line EE shown in Fig. 3OA in a direction shown by the arrows. Fig.3IAillustratesamoldusedtoformareflectingboard relating to a fourth embodiment, showing a space to form the reflecting board, and Fig. 31B is a cross-sectional view illustrating the mold along a line FF shown in Fig. 31A in a direction shown by the arrows. Fi'g. 32 is used to explain a reflecting board formation step relating to the fourth embodiment. Fig. 33A is a cross-sectional view illustrating a mold and a printed wiring board, in such a state the mold is placed on the printed wiring board to form the reflecting board, and Fig. 33B is a cross-sectional view illustrating the mold and the..printed wiring board along a line GG shown in Fig. 33A in a direction shown by the arrows. Fig. 34A illustrates a mold relating to a thirteenth modification example andaprintedwiringboardin such a state that the mold is placed on the printed wiring board to form the reflecting board, with a part broken away to show an inner structure, and Fig. 34B illustrates the mold and the printed wiring board in a direction H shown by the arrow in Fig. 34A. Fig.35isaperspectiveviewillustratinganLEDmounting module relating to a fourteenth modification example. Fig. 36Ais aperspectiveviewillustratingamoldto form reflecting pieces relating to the fourteenth modification example, and Fig. 36B is a cross-sectional view illustrating the mold along a plane I shown in Fig. 36A in a direction shown by the arrows. Fig. 37 is used to explain a reflecting piece formation step in'the fourteenth modification example. Fig.38isaperspectiveviewillustratingaprintedwiring board on which preliminary reflecting pieces are formed. Fig. 39 is a cross-sectional view illustrating a mold relatingtoafifteenthmodificationexampleandaprintedwiring board in such a state that the mold is placed on the printed wiring board. BEST MODE FOR CARRYING OUT THE INVENTION <FIRST EMBODIMENT The followingdescribes alightingapparatus relatingto a first embodiment of the present invention, an LEDmodule and an LED mounting module used in the lighting apparatus, and a manufacturingmethodoftheLEDmountingmodule, withreference to the attached drawings. (1) LIGHTING APPARATUS 1. CONSTRUCTION Fig. 1 is an overall view illustrating the lighting apparatus relating to the first embodiment. A lighting apparatus 10 is constituted by an LED module 100, a holding part 20, a reflection umbrella 30, a case 40, a cap 50, and a lighting unit (not shown in Fig. 1) . The LED module 100 has LED devices mounted therein. The holding part 20 is used to hold the LED module 100. The reflection umbrella 30 reflects light emitted by the LED module 100 forward. The case 40 is attached to a surface of the holding part 20 which is oppositetoasurfaceonwhichtheLEDmodule 100 isprovided. The cap 50 is attachedto anendofthe case 40 whichis opposite to a surface connected to the holding part 20. The lighting unit is housed in the case 40, and used to cause the LEDmodule 100 to illuminate. Thecap50isascrew-typecapusedintypicalincandescent lamps, for example, E26 type. To reflect light emitted from theLEDmodule100forward, aninternalsurfaceofthereflection umbrella 30 is applied with white paint, or is a mirror finish surface, if the reflection umbrella 30 is made of a metal, for example. The lighting unit uses publicly-known circuits to cause LEDdevicesto emit lightbymeans ofa commercialpowersource. For example, the lighting unit includes a rectifying circuit that rectifies alternating-current (AC) power supplied by a commercial power source into direct-current (DC) power, a voltage adjusting circuit that adjusts a voltage value of the DC power obtained by the rectifying circuit, and the like. 2. LED MODULE 100 Fig. 2 is a perspective view illustrating the LEDmodule 100 relating to the first embodiment. Fig. 3A is an enlarged cross-sectional view illustrating a part of the LEDmodule 100 in which each LED device is mounted, and Fig. 3B is an enlarged plan view illustrating the part of the LED module 100 without a lens board. J The LED module 100 is constituted by a plurality of LED devices 110, an LEDmounting module 120, and a lens board 130. The LED devices 110 are mounted on a front surface of the LED mountingmodule 120. The lensboard130 isprovidedtothe front surface of the LED mounting module 120. The LED module 100 is a multiple-point light source, with the LED devices 110 being arranged regularly in directions perpendicular to each other. In the first embodiment, the LED devices 110 are arranged in amatrixof 4 x 4 at evenintervals, inrowandcolumndirections perpendicular to each other, as shown in Fig. 2. The LEDmodule 100 functions as a sheet light sourcebycausingtheLEDdevices 110 to emit light. The distinction between the LED module 100 and the LED mounting module 120 is whether the LED devices 110 aremounted or not. Fig.4 isaperspectiveviewillustratingtheLEDmounting module120relatingtothefirstembodiment. Fig.5Aisanenlarged cross-sectional view illustrating a part of the LED mounting module 120 in which each LED device 110 is to be mounted, and Fig. 5B is an enlarged plan view illustrating the part of the LED mounting module 120 in which each LED device 110 is to be mounted. j The LED mounting module 120 is constituted by a printed wiring board 123 (corresponding to a substrate in the claims) andareflectingboard126 (correspondingtoareflectingmember in the claims) as shown in Figs. 3 to 5. The printed wiring board 123 is formed in such a manner that wiring patterns 124 to mount the LED devices 110 are provided on a main surface of an insulation board 122. The reflecting board 126 has reflectingholes126aprovidedincorrespondencewithlocations, on the printed wiring board 123, where the LED devices 110 are to be mounted. The reflecting board 126 is made of a resin. The reflecting board 126 and the printed wiring board 123 are directlyadheredto each other at theirmain surfaces that face each other. The insulation board 122 is made of a ceramic material, forexample. TheceramicmaterialincludesatleastoneOfAl2O3, AlN, SiO2, andSiC. Inthefirstembodiment, theceramicmaterial includes AI2O3, as an example. The insulation board 122 made of the ceramic material containing at least one of Al2O3, AlN, SiO2, and SiC has high heat conductivity. This isparticularlyfavorable inimproving heatdissipationbecausetheLEDdevices 110 generateheatwhen emitting light. The wiring patterns 124 include patterns 124a that are formed on a front surface of the insulation board 122 and to be connected to the LED devices 110 (hereinafter referred to as surfacepatterns 124a), patterns 124bthat are formedwithin the insulation board 122 (hereinafter referred to as internal patterns 124b), and patterns 124c that are formed on the front surface of the insulationboard122 andtobe connectedtopower supplyterminals (hereinafterreferredtoas terminalpatterns 124c) . The surface patterns 124a and the internal patterns 124b are connected to each other through via holes 152b, and the terminal patterns 124c and the internal patterns 124b are connected to each other through via holes (not shown) . Forming the wiring patterns 124 on the front surface of andwithintheinsulationboard122hasthefollowingadvantages. Thetotal areaofthe surfacepatterns 124a onthe front surface of the insulation board 122 can be reduced, which enables the LED devices 110 to be mounted at a high density. In addition, the wiring patterns 124 can be more freely designed. The reflecting holes 126a formed in the reflecting board 126 are each tapered toward its end facing the printed wiring board 123 (i.e. downward) as shown in Fig. 3, for example. In otherwords, thediameterofthe reflectinghole 126agradually increases from its bottom end to its open end. The reflecting board126ismadeofathermosettingresinmaterial, specifically speaking, an epoxy resin and fillers. The fillers include at least one of TiO2, SiO2, Al2O3, and BaSO4. The first embodimentuses athermosettingresinmaterial containing TiO2, for example. Beingmade of the resin material containingatleastoneofTiO2, SiO2, Al2O3, andBaSO4asfillers, the reflecting board 126 has improved reflectance characteristics. As an alternative method to improve the reflectance characteristics, a thin metal film may be formed on a wall of each reflecting hole 126a (a reflecting surface) bymethods such as deposition andplating, for example. If such is the case, it does notmatterwhether the thermosettingresin material formingthereflectingboard126 contains fillers such as TiO2 br not. Such a thinmetal film can be formedby deposition in the following manner. First, a wiring pattern exposed in the reflecting hole 126a in the reflecting board 126 is masked. Next, a highly-reflective metal material such as Ag, Au and Al is deposited in reduced-pressure atmosphere, for example. When using a different method, a metal paste of Ag, Au, Al or the like is applied to the reflecting surface, and heated to be cured, for example. The LED devices 110 each have an anode and a cathode on its back surface as shown in Fig. 3. The anode and cathode are connected to the wiring patterns 124a on the printed wiring board 123, through gold bumps 111 and 112, for example. Thus, each LED device 110 is (flip-chip) mounted. The light emitted from the LED device 110 may need to be convertedintolightofa.differentcolor. Inthiscase,aphosphor 140, which is made of silicone or an epoxy resin containing predeterminedphosphor powders, is formed so as to enclose the LED device 110 therein. The lens board 130 is made of a translucent epoxy resin, for example. As shown in Fig. 3, the lens board 130 partially protrudes to form a hemispherical shape (convex lens 130a), in correspondence with each reflecting hole 126a in the reflecting board 126, that is to say, the location where each LED device 110 is mounted. The reflecting hole 126a is filled with the same resin material forming the lens board 130, so that the resinmaterial inthe reflecting hole 126a is combined with the convex lens 130a. ■ The reflecting board 126 and the lens board 130 have a substantiallysquareplanar shape, for example. The insulation board 122 has a rectangular planar shape whose shorter side has a length equivalent to a side of the reflecting board 126 and the lens board 130. The terminal patterns 124c are formed in a portion of the front surface of the insulation board 122, in which the reflecting board 126 and the lens board 130 are not formed. 3. MANUFACTURING METHOD OF THE LED MODULE 100 A manufacturing method of this LED module 100 includes a printedwiringboard formation step, a half-cured reflecting board formation step, an LED mounting module formation step, an LED mounting step, a phosphor formation step, and a lens board formation step. In the printed wiring board formation step, theprintedwiringboard 123 is formed. In the half-cured reflectingboard formation step, the reflectingboard 126made of a resin in a half-cured state (corresponding to "inB stage" in the claims) is formed (hereinafter referred to a half-cured reflecting board) . In the LED mounting module formation step, thehalf-curedreflectingboardis adheredtothe front surface oftheprintedwiringboard 123, to formtheLEDmountingmodule 120. In the LED mounting step, the LED device 110 is mounted ontheLEDmountingmodule 120. Inthephosphor formation step, the phosphor 140 is formed so as to enclose the mounted LED device 110 therein. In the lens board formation step, the lens board 130 is formed. A. PRINTED WIRING BOARD FORMATION STEP Fig.6isusedtoexplaintheprintedwiringboardformation step. Here, it is assumed that the insulation board 122 constituting the printed wiring board 123 is made of a ceramic material including AI2O3. Tostartwith, agreensheet 151madeofaceramicmaterial including AI2O3 ((a) in Fig. 6) is used. On a front surface of the green sheet 151, patterns 153, which are to be formed into the internal patterns 124b, are formed by screen-printing or the like, using a conductive paste made of tungsten, copper or the like. A green sheet 152, different from the green sheet 151, is next used. In the green sheet 152, through holes are formed inpredeterminedlocationsbyblankingorthelike. Thethrough holesarefilledwithaconductivepastemadeoftungsten, copper or the like, to form via holes 152a. ( (c) in Fig. 6) . The green sheet 152 with the via holes 152a is placed on the front surface of the green sheet 151 on which the patterns 153 are formed, and the green sheets 151 and 152 are applied with pressure, to be adhered to each other. ( (d) in Fig. 6) On a surface of the resulting laminate, or a front surface of the green sheet 152 which faces away from the green sheet 151, patterns 154 which are to be formed into the surface patterns 124a are formed by screen-printing using a conductive paste made of tungsten, copper or the like. ((e) in Fig. 6) Lastly, the green sheets 151 and 152 are fired at a predeterminedtemperature, andthe patterns 154 areplatedwith nickel, gold or the like. Thus, trie printed wiring board 123, which is the insulationboard 122 with thewiringpatterns 124, is completed ((f) in Fig. 6) . In the above explanation of the printed wiring board formationstep, thesurfacepatterns124aareformedbyprinting. However, the surfacepatterns 124a canbe alternatively formed by sputtering, deposition, plating or the like, for example. In addition, the conductive paste may be alternatively made of silver or the like inaccordance withthe firing temperature of the ceramic material. B. HALF-CURED REFLECTING BOARD FORMATION STEP Fig. 7A is a plan view illustrating a mold used to form thehalf-curedreflectingboard, anclFig.7Bisacross-sectional view illustrating the mold along a line AA shown in Fig. 7A in a direction shown by the arrows. Amold 160 is formed like a box which is open at the upper side. A planar shape of the mold 160 is substantially square incorrespondencewiththeplanarshapeofthe reflectingboard 126. The mold 160 has a base 161, and side walls 162, 163, 164 and165thatareprovidedsoastoextendverticallyatdifferent edges of the base 161. On an internal surface of the base 161, conoidal protrusions 166 are arranged in a matrix of 4 x 4. Here,theconoidalprotrusions166haveashapeformedbyremoving aportion of a cone which includes an apex. When the half-cured reflectingboardis formedusingthismold160, theprotrusions 166 correspond to the reflecting holes 126a in the reflecting board 126. Fig. 8 isusedtoexplainthehalf-curedreflectingboard formatio'n step. To start with, this mold 160 is arranged so that the base 161 faces downward, and is substantially horizontal. Subsequently, themold 160 is filled with a liquid epoxy resin 167, for example, ((a) in Fig. 8) and an unnecessary amount of the epoxy resin 167 is then removed. Theresinmaterial167principallyincludesanepoxyresin, and further contains TiO2 to enhance reflection efficiency. Theunnecessaryamountoftheepoxyresin167canberemoved by using a squeegee 168, for example. Specifically speaking, one side of the squeegee 168 is placed so as to be in contact with an upper edge of the mold 160, and the squeegee 168 is then slid in a direction shown by the arrow in (b) in Fig. 8, for example. After this, the epoxy resin 167 is heated at 800C for 15 minutes, for example, to be half-cured. Thus, the half-cured reflectingboard 167a is formed. The conditions of heating can vary, and need to be appropriately determined according to a resin material forming the reflecting board 1.26. C. LED MOUNTING MODULE FORMATION STEP Fig.9isusedtoexplaintheLEDmountingmoduleformation step. The half-cured reflecting board 167a is placed on the surface of the printed wiring board 123 on which the wiring patterns 124 are formed, in such a manner that the location on the printed wiring board 123 where the LED device 110 is to be mounted corresponds to a substantially center of a hole 167b formed in the half-cured reflecting board 167a. ( (a) in Fig. 9) At this point of the manufacturing method, the resin material 167 forming the half-cured reflecting board 167a is half-cured, orinBstage. Therefore, theshapeofthehalf-cured reflecting board 167a can be maintained. For this reason, the half-cured reflecting board 167a canbe handledwith ease, and placed efficiently. Subsequently, thehalf-curedreflectingboard167a, being placedontheprintedwiringboard123, is appliedw±thpressure bymeans ofapressurizingmember 169. Whilebeingappliedwith pressure, the half-cured reflecting board 167a is heated, to be cured. By the heating, the viscosity of the resin material 167 forming the half-cured reflecting board 167a is lowered. Thus, the resin material 167 is completely cured, while the half-curedreflectingboard167ais incontactwith theprinted wiring board 123. As a result, the printed wiring board 123 andthe reflectingboard 126 are directlyadheredto each other at their surfaces that face each other. This means that the LED mounting module 120 is completed ( (c) in Fig. 9) . When the half-cured reflecting board 167a is placed on the front surface of the printed wiring board 123, there may be a gap between their surfaces that face each other due to the wiring patterns 124 or the like. Since the viscosity of the resinmaterial 167 formingthe half-curedreflectingboard 167a is lowered by the heating, the resin material 167 flows into such a gap. Therefore, the printed wiring board 123 and thereflectingboard126canbeadheredtoeachothercompleteIy. Thus, sincethereisnogapbetweenthesurfacesofthereflecting board 126 andtheprintedwiringboard123 that face eachothter, lightemittedfromtheLEDdevice110canbeefficientlyreflected toward a predetermined direction without being lost. In an example casewhere a reflectingboard andaprinted wiring board are adhered to each other bymeans of an adhesive layer, an adhering sheet or the like needs to be placed on the printed wiring board, before the reflecting board is placed on the printed wiring board. The adhering sheet is very tlαin, and therefore difficult to be handled. On the other hand, the first embodiment of the present invention utilizes the half-curedreflectingboard167ahavingashapeofthereflecting board 126, which can be easily and efficiently placed on the printed wiring board 123. D. LED MOUNTING STEP Fig. 10 is used to explain the LED mounting step. The gold bumps 111 and 112 are, for example, formed, at the location, on the LED mounting module 120, where the LED device 110 is to be mounted ((a) in Fig. 10) . It goes with.out saying that the LED device 110 is to be mounted on the wiring patterns 124. Afterthis, theLEDdevice 110 is placedonthe goldbumps 111 and112, bymeans ofa collet 170 whichholds the LEDdevice 110 by suctioning ((b) in Fig. 10) . Specifically speaking, the LED device 110, in a state of being suctioned by the collet 170, is placed on the gold bumps 111 and 112, heated, and then subjected to high-frequency (ultrasonic) vibration. In this way, the gold bumps 111 and 112 melt and then solidify. As a consequence,theLEDdevice110ismountedonthesurfacepatterns 124a through the gold bumps 111 and 112. Inthepresent description, theLEDmodule 100 is defined as includingthe lensboard 130. Forthis reason, the resulting moduleacquiredbymountingtheLEDdevice110ontheLEDmounting module 120 is referred to as an LED-mounted module, in order to be distinguished from other modules. E. PHOSPHOR FORMATION STEP Fig. 11 is used to explain the phosphor formation step. To form the phosphor 140, a molding jig 171 is placed on the LED-mounted module, in which the LED device 110 has been mounted. The molding jig 171 is substantially plate-like, and hasprotrudingparts 171bincorrespondencewiththereflecting holes 12βa in the reflecting board 126. When the molding jig 171 is placed, the protruding parts 171b protrude into the reflectingholes 126a, andareincontactwiththefrontsurface oftheprintedwiringboard123attheirtopedge. Theprotruding parts 171b have through holes 171a in their center. Afterthis, aresinmaterial172isdroppedintothethrough holes 171a in the molding jig 171 ((a) in Fig. 11) to form the phosphor 140. Here, the resinmaterial 172 is formed bymixing a liquid (before cured) resin with predetermined phosphor powders. The amount of the resinmaterial 172 dropped into each through hole 171a is determined according to the size of the phosphor 140. After the resin material 172 is dropped into all of the through holes 171a ((b) in Fig. 11), the resin material 172 is heated at 1500C for 30 minutes, for example, to be cured. Here, the resin material 172 can be cured under different conditions. When the resin material 172 is completely cured, the molding jig 171 is removed from the LED-mounted module. F. LENS BOARD FORMATION STEP Fig. 12jis usedto explainthe lens board formation step. To form the lens board 130, a molding jig 173 is placed on the LED-mounted module, in which the phosplhor 140 has been formed in the phosphor formation step. The mo-lding jig 173 is substantially plate-like, and has depressions 174 in correspondence with locations of the reflecting holes 126a in thereflectingboard126. Here, thereisapredetermineddistance (corresponding to a thickness of the lens board 130) between surfaces of the molding jig 173 and the reflecting board 126. Afterthis, aliquid (beforecured) resin materialtoform the lens board 130 is injected into the molddLng jig 173 ((a) in Fig. 12) . When the injection of the resin material is completed, theresinmaterialisheatedat1500Cfor10minutes, forexample, tobecured. Here, theresinmaterialcanbecuredunderdifferent conditions. When the resinmaterial is completely cured, themolding jig 173 is removed, thereby completing the LED module 100 ((b) in Fig. 12) . 4. OTHER MATTERS The first embodiment of the present invention is not limitedtothosedescribedintheabovesection "2. LEDMODULE". The above description only serves as an example in explaining thetypeoftheLEDdevice110 (howtheLEDdeviceHlOisconnected), the configuration of the insulation board 122, the phosphor 140 (provided or not), the configuration and formation method of the phosphor 140, the formation method of the reflecting board 126 and the like. The first embodiment includes the followingmodificationexamples. Thefollowingdescribes first to fourthmodificationexamples basedon the first embodiment, with reference to Figs. 13 and 14. Fig. 13A is a cross-sectional view illustrating an LED module relating to the first modification example, and Fig. 13Bisacross-sectionalviewillustratinganLEDmodulerelating to the second modification example. Note that, in Figs. 13A and 13B, the same referencenumerals as inthe first embodiment areusedtoindicateconstituentshavingthesameconfiguration as in the first embodiment. Fi'g. 13A shows an LED module 200 relating to the first modificationexample. TheLEDmodule200doesnothaveaphosphor enclosing the LED device 110 therein. IflightemittedbytheLEDdevice110needstobeconverted into light of a different color, a resin material forming a lens board 202 may contain predetermined phosphor powders, or aliquidcontainingphosphorpowdersmaybeappliedtoanexternal surface of the lens board 202 to form a phosphor layer. By utilizing the manufacturing method of the LED module 100, this LED module 200, in which the reflecting board 126 and the printed wiring board 123 are directly adhered to each other at their surfaces that face each other, can be basically realized. Fig. 13B shows an LED module 220 relating to the second modification example. Instead of the LED device 110 and the phosphor 140, the LED module 220 has an LED device 222 which has two electrodes on its front surface, and a phosphor 224 enclosing the LED device 222 therein, which is formed without using a molding jig. Havingtheelectrodesonits frontsurface, theLEDdevice 222 is connected to wiring patterns 226 formed on the front surface of the insulation board 122, using gold wires 228 and 230.Thephosphor224isformedbydroppingaliquidresinmaterial containing predetermined phosphor powders without using a molding jig. To be specific, the resin material has not been cured and has a high viscosity, and can therefore maintain its shape to a certain extent, when dropped. Based on this, the resin material is just dropped and then cured. As shown in Fig. 13B, one of the wiring patterns 226 is formed so as tomount the entire LED device 222. The LED device 222 is attached to this wiring pattern 226 using an insulative or conductive adhesive agent, a silver paste, or the like. Alternatively, the wiring pattern 226 may not be formed large enough to mount the LED device- 222- as shown in Fig. 13B. In this case, the LED device 222 is directly attached to the insulation board 122 using an adhesive agent or the like. The LED module 220 relating to the second modification example can be realized utilizing the manufacturing method of theLEDmodule 100, if thephosphor formation step is performed intheabove-describedway. Thereflectingboard126andaprinted wiring board 232 are directly adhered to each other at their surfaces that face each other also in the LED module 220. Fig. 14A is a cross-sectional view illustrating an LED module relating to the third modification example, and Fig. 14Bisacross-sectionalviewillustratinganLEDmodulerelating to the fourth modification example. Note that, in Figs. 14A and 14B, the same reference numerals as inthe first embodiment areusedtoindicateconstituentshavingthesameconfiguration as in the first embodiment.' Fig. 14A illustrates an LED module 250 relating to the third modification example. The LED module 250 has wiring patterns only on a front surface of an insulation board 252. Fig. 14B illustrates an LED module 270 relating to the fourth modificationexample. TheLEDmodule270alsohaswiringpatterns only on a front surface of an insulation board 272. According to the first embodiment, the insulation board 122 is formed by two layers of the green sheets 151 and 152 as showninFig. 6. Furthermore, thepatterns 153are sandwiched betweenthegreensheets151and152, andconnectedtothesurface patterns 124a through the via holes 152b. However, the first embodiment is not limited to such. As an alternative example, a printed wiring board 256 relating to the third modification example shown in Fig. 14Amaybe used. The printedwiringboard 256isconstitutedbytheinsulationboard252andwiringpatterns 254 formed only on the front surface of the insulation board 252. As another alternative example, a printed wiring board 276 relating to the fourth modification example shown in Fig. 14B may be used. The printed wiring board 276 is constituted bythe insulationboard272 andwiringpatterns 274 formedonly on the front surface of the insulation board 272. <SECOND EMBODIMENT ThefollowingdescribesanLEDmodulerelatingtoasecond embodiment of the present invention, with reference to the attached figures. The second embodiment is different from the first embodiment in that an insulation board made of a composite material containing an inorganic filler and a thermosetting resin is -used, and that a metal board is provided on a back surface of a printed wiring board. (1) CONSTRUCTION OF LED MODULE Fig. 15 is a schematic cross-sectionalviewillustrating the LED module relating to the second embodiment. An LED module 300 relating to the second embodiment includes an LED device 310, an LED mounting module 320, and a phosphor 340, and a lens board 330. The LED device 310 is mountedontheLEDmountingmodule320. Thephosphor340encloses themountedLEDdevice310therein. Thelensboard330isprovided on a front surface of the LED mounting module 320. The LED mounting module 320 is constituted by a printed wiring board 320a, a reflecting board 326 made of a resin, and a metal board 350 attached to a back surface of the printed wiring board 320a. The printed wiring board 320a is formed by aninsulationboard323madeof a compositematerial containing anAl2O3 (alumina) fillerandanepoxyresin, andwiringpatterns tomounttheLEDdevice310, ona front surfaceoftheinsulation board 323. Theinsulationboard323ismadeupbyoneormoreinsulation layers, for example, two insulation layers in the second embodiment. Here, an insulation layer including the front surface of the insulation board 323 is referred to as an upper insulation layer 321, and an insulation layer including a back surface of the insulation board 323 is referred to as a lower insulation layer 322. Wiring patterns 324 and 325 are respectively formedon front surfaces ofthe insulation layers 321 and 322. The wiring patterns 324 and 325 are connected to each other through via holes 327. To further distinguish the patterns 324 and 325, the patterns 325 formed on the lower insulation layer 322 are specifically referred to as internal patterns 325, and the patterns 324 formed on the upper insulation layer 321 are specifically referred to as surface patterns 324. The LEDdevice 310 ismounted onthe surface patterns 324 through gold bumps 328 and 329, as in the first embodiment. The phosphor 340 and the lens board 330 each have the same configuration as in the first embodiment, and are each formed using the same method as in the first embodiment. Similarly to the first embodiment, the reflecting board 326 and the printed wiring board 320a are directly adhered to eachotherinthesecondembodiment. This is achievedbyplacing thereflectingboard326madeofaresinmaterialinahalf-cured state on the front surface of the printed wiring board 320a, and then heating and applyingpressure to the reflecting board 326. (2) MANUFACTURING METHOD The followingdescribesaformationmethodoftheprinted wiring board 320a relating to the second embodiment. Fig.16isusedtoexplaintheformationstepoftheprinted wiring board 320a with the metal board 350 being attached to its back surface. To start with, a prepreg having a copper foil 366 on one of itsmain surfaces (front surface) and ametal board 362 made of aluminum are used. The prepreg is made of an alumina filler andanepoxyresin (notyet cured), andcorresponds tothe lower insulationlayer322ofthecompletedprintedwiringboard320a. The prepreg is adhered to the metal board 362 in such a manner that aback surface of the prepreg is in contact with themetal board362. Then, theprepregi'sheatedandappliedwithpressure, so as to be (completely) cured and adhered to the metal board 362 ((a) in Fig. 16) . After this, patterns 366a corresponding to the internal patterns 325 are formed in the copper foil 366 that is adhered to a front surface of an insulation board 364 with the metal board 362 being adhered to its back surface ((b) in Fig. 16) . Thepatterns366aareformedusingphotolithography, forexample. In detail, a dry film (aphotoresist film) andan exposure film (a mask film) having a pattern for the internal patterns 325 are adhered to a front surface of the copper foil 366, in this order. After this, ultraviolet rays or the like are irradiated to the copper foil 366 with the films, so that the dry film is developed. Subsequently, etching is performedon the copper foil 366 based on the developed pattern. Then, the dry film is removed. After the patterns 366a corresponding to the internal patterns 325 are formed, a prepreg corresponding to the upper insulationlayer321 (withacopperfoil369onitsfrontsurface) is adhered to a surface of the insulation board 364 on which the patterns 366a are formed. By heating and applying pressure totheprepreg inordertocure theprepreg, aninsulationboard 368 is adhered to the insulation board 364 that has already been formed ((c) in Fig. 16) . Subsequently, parts ofthe copper film369 corresponding to locations of the via holes 327 in the printed wiring board 320a are removed by etching based on photolithography, for example. Through holes 371 are then formed in correspondence with the removedparts, bymeans of CO2 laser, for example ( (d) in Fig. 16) . Afterthis, copperisplatedinsidethethroughholes 371, and onto the front surface of the copper foil 369. Thus, via holes375areformed ((e) inFig.16) . Alternatively, thethrough holes371maybefilledwithaconductivepastemadeoftungsten, copper, silver or the like, and copper is then plated onto the front surface of the copper foil 369. Here, the copper-plated copper foil 369 is referred to as a copper layer 379. Lastly, patterns corresponding to the surface patterns 324 are formed in the copper layer 379, which completes the printedwiringboard320awiththemetalboard350beingattached to its back surface as shown in (f) in Fig. 16. The surface patterns324areformedbymeansofphotolithography, forexample, as well as the internal patterns 325. Specifically speaking, thepatterns formedinthe copper layer 379 areplatedwithnickel, goldorthe like, forexample, to complete the surface patterns 324. If this plating process comes last, the surface patterns 324 can^achieve improved connectionwiththegoldbumps328and329andenhancedcorrosion resistance. (3) OTHER MATTERS The LED mounting module 320 and LED module 300 relating to the second embodiment are not limited to those described above. The above description only serves as an example in explaining the type of the LED device 310 (how the LED device 310 is connected) , the configuration of the insulation board 323, the phosphor 340 (provided or not), the configuration and formation method of the phosphor 340, the formation method of the reflecting board 326 and the like. The second embodiment can be realized by using the modification examples explained in the section of "4. OTHER MATTERS" in the first embodiment. The number and arrangement of the LED devices 310 in the LED module 300 are not limited to those disclosed in the above description. The LED devices 310 are arranged in a matrix of 4 x 4 according to the above description, but may be arranged inNrows andMcolumns {NandMare sameordifferent integers), for example. In addition, the LED devices 310 can be arranged to form a polygon (e.g. a rhombus or triangle) or an ellipse (including a circle), when seen from above. Accordingtothe secondembodiment, the insulationboard 323 is made upby the two layers 321 and 322 made of a composite material containing an alumina filler and an epoxy resin, and the patterns 324 and 325 for electrical connection are respectivelyformedonthe layers 321 and322, as showninFigs. 15 and 16. However, the second embodiment is not limited to such. The following describes fifth and sixth modification examplesbasedonthe secondembodiment, withreferenceto Fig. 17. Fig. 17A is a cross-sectional view illustrating an LED module relating to the fifth modification example, and Fig. 17Bisacross-sectionalviewillustratinganLEDmodulerelating to the sixth modification example. Note that, in Figs. 17A and 17B, the same reference numerals as in the second embodiment areusedtoindicate constituentshavingthesameconfiguration as in the second embodiment. As shown in Fig. 17A, an LED module 370 relating to the fifthmodification example includes aprintedwiringboard 376 constitutedby an insulation board 372 andwiring patterns 374 formed on a front surface of the insulation board 372. The insulationboard 372 ismadeupbyone layermade of a composite material containing an alumina filler and an epoxy resin. The printed wiring board 376 is formed in the following manner. Patterns corresponding to the wiring patterns 374 are formed on the insulation board 372, and plating is last performed on the patterns, in the manner shown in (b) in Fig. 16. As shown in Fig. 17B, an LED module 380 relating to the sixth modification example includes an LED device 390 and a phosphor 392. The LED device 390 is the same as the LED device 222 relating to the second modification example, and has an anode and a cathode on its front surface. The phosphor 392 is formed in the method described in the second modification example. The LED module 380 relating to the sixth modification example is basically realized using the manufacturing method oftheLEDmodule 100 relatingtothe first embodiment. However, a printed wiring board 384 is formed in the method described inthefifthmodificationexample, andthephosphor392isformed usingthemethoddescribedinthe secondmodificationexample. In the LEDmodule 370 relating to the fifthmodification exampleandtheLEDmodule380relatingtothesixthmodification example, the reflecting board 326 is directly adhered to the printedwiring board (376 and 384) at their surfaces that face each other. While the insulation board 323 relating to the second embodiment is made upby the two insulation layers 321 and 322, the insulation board 372 relating to the fifth and sixth modificationexamples ismadeupbyone insulation layer. Here, however, the insulation board (323 and 372) can be made up by three or more insulation layers. <FURTHER MODIFICATION EXAMPLES OF THE FIRST AND SECOND EMBODIMENTS> Theabovedescribes the first andsecondembodiments and thefirsttosixthmodificationexamplesofthepresentinvention. However, thepresent invention is not limitedtothose specific examples, and further includes the following modification examples. In the following, "the first and second embodiments andthelike"referstothefirsttosixthmodificationexamples, in addition to the first and second embodiments. (1) REFLECTING BOARD 1. FORMATION METHOD Accordingtothefirstandsecondembodimentsandthelike, the half-curedreflectingboard is formedin such amanner that the resin material is poured into the mold and half-cured. Alternatively, the half-cured reflecting board may be formed by injection molding, for example. This is described in the following as a seventh modification example. Fig. 18 is an exploded perspective view illustrating a mold relating to the seventh modification example to form a half-curedreflectingboard. Fig. 19Ais across-sectionalview illustrating themold, and Fig. 19B is aplanview illustrating the mold with an upper part being removed. Amold 400 is used to form a half-cured reflecting board based on injection molding. As shown in Fig. 18, the mold 400 includes a lower part 420, which, for example, corresponds to the mold 160 in the first embodiment, and an upper part 410 thatclosesanopeningofthelowerpart420. Toformahalf-cured reflecting board, the upper part 410 and the lower part 420 arecombined, tocreateaformationspacetherebetween. Itshould benotedthat aresinmaterial injectedintotheformationspace does not leak, when the upper part 410 and the lower part 420 are combined. The lower part 420 is formed like a box, and has a base 421 and four side walls 422, 423, 424 and 425, similarly to themold160 inthefirstembodiment. Onthebase421, protrusions 426 to form reflecting hole's are provided. In the side wall 422, an inlet aperture 427 is provided for a resin material. In the side wall 424, an outlet aperture 428 is provided--for a resin material. To form the half-cured reflecting board, a liquid resin material is injected into the formation space formed when the upper part 410 and the lower part 420 are combined, through theinletaperture 427, tosuchanextentthattheresinmaterial pours out through the outlet aperture 428. When the mold 400 isfilledwiththe resinmaterial, theresinmaterialisheated, to be half-cured. When the half-cured reflecting board is formed using injection molding, the same conditions are applied as in the half-curedreflectingboardformationsteprelatingtothefirst embodiment. The use of injection molding enables a half-cured reflectingboardwithhigh dimensional accuracytobe obtained efficiently. Therefore, when the half-cured reflecting board obtainedusinginjectionmoldingisplacedontheprintedwiring boardto'be adhered to theprintedwiringboardtogether, their surfaces can be substantially parallel to each other. Hence, thepressurizingmember169 canapplyevenpressuretotheupper surface of the half-cured reflecting board. This achieves a reflecting board, or an LED'mounting module ultimately, with little unevenness in thickness. 2. CONSTRUCTION Accordingtothefirstandsecondembodimentsandthelike, thereflectingboardisformedlikeoneplate, andhas16separate reflecting holes in correspondence with locations where the LED devices are to be mounted. However, the first and second embodimentsandthelikearenotlimitedtosuch. Alternatively, a separate reflecting piece may be formed in correspondence with a location of each of the LED devices, and each reflecting piece is separately adhered to the printed wiring board. The following describes eighth and ninth modification examples where separate reflectingpieces areprovidedinstead of the reflecting board, with reference to Figs. 20, 21, 22 and 23. Fig.20isaperspectiveviewillustratinganLEDmounting module relating to the eighth modification example. As shown in Fig. 20, an LEDmounting module 510 relating to the eighthmodification example is constitutedby a printed wiring board 512 with wiring patterns (not shown in Fig. 20) and apluralityof (16) reflectingpieces 514 formed on a front surface of the printed wiring board 512. As clearly seen from Fig. 20, each reflecting piece 514 has a reflecting hole 516 in its center. In other words, one reflectingpiece514 hasonereflectinghole516. Thereflecting hole 516 is tapered downward towards the printed wiring board 512 as in the first and second embodiments and the like. The reflecting piece 514 is adhered to the printed wiring board 512 in the samemanneras in the first embodiment. Specifically- speaking, the reflecting piece 514 made of a resin material inahalf-curedstateisfirstplacedatapredeterminedlocation on the printed wiring board 512. After this, while a pressure is applied to a front surface of the reflecting piece 514, the reflecting piece 514 is heated, to be completely cured. Fig. 21A is a plan view illustrating a mold used to form the reflecting pieces 514 relating to the eighth modification example, and Fig. 21B is a cross-sectional view illustrating themold along a line BB shown in Fig. 21A in a direction shown by the arrows. As shown in Fig. 21, a mold 520 is formed like a box, and hasabase521andfoursidewalls522, 523, 524and525, similarly to the mold 160 used to form the reflecting board 126 relating to the first embodiment. Aninternal space ofthebox-likemold520 is dividedinto 16 sub-spaces, in total, by horizontal walls 527 and vertical walls 526 that extend in horizontal and vertical directions (X and Y directions in Fig. 21A) and the side walls 522, 523, 524 and 525. In substantially the center of each sub-space, a protrusion 528 is provided on the base 521, to form the reflecting hole 516 formed in the reflecting piece 514. Note that the protrusion 528 is tapered from the base 521 to the open end of the mold 520, in correspondence with the shape of the reflecting hole 516. The internal space of the mold 520 is divided into 16 sub-spaces so that the 16 reflecting pieces 514 are obtained at a time. However, the eighth modification example may alternatively use a mold corresponding to each sub-space, so that one reflecting piece 514 is obtained at a time. Fig.22 isaperspectiveviewillustratinganLEDmounting module relating to the ninth modification example. Similarly to the LEDmountingmodule 510 relating to the eighthmodificationexample, anLEDmountingmodule530relating to the ninth modification example is constituted by a printed wiring board 532 including wiring patterns (not shown in Fig. 22) and a plurality of (16) reflecting pieces 534 formed on a front surface of the printed wiring board 532. As clearly seen from Fig. 22, each reflecting piece 534 has one reflecting hole 536 in its center. The reflecting hole 536 is tapered downward towards the printed wiring board 532. The reflectingpiece 534 is adheredto the printedwiringboard 532 in the same manner as in the eighth modification example. Fig. 23A is a plan view illustrating a mold used to form the reflecting pieces 534 relating to the ninth modification example, and Fig. 23B is a cross-sectional view illustrating the mold along a line CC shown in Fig. 23A in a direction shown by the arrows. As shown in Fig. 23, a mold 550 is plate-like, and has 16 depressions 552 arranged in 4 x 4 in horizontal andvertical directions (X and Y directions in Fig. 23A) . A planar shape of each depression 552 is like a ring as shown in Fig. 23A. The inner diameter of the ring-like depression 552 increases from a front (open) side of the mold 550 toward the base of themold550, incorrespondencewiththe shapeofthereflecting hole 536 (see a wall 553 of the depression 552) . 3. RESIN MATERIAL Accordingtothefirstandsecondembodimentsandthelike, the reflecting board is made of an epoxy resin, but canbe made ofadifferentresinsuchasanunsaturatedesterresin, aphenolic resin, a polyimide resin, and a polyphthalamide resin. (2) OTHER MATTERS Accordingtothefirstandsecondembodimentsandthefirst toninthmodificationexamples,thehalf-curedreflectingmember (indicating the half-cured reflecting board and pieces) is placed on the printed wiring board, and then completely cured tobeadhered. However, the followingmethodis also applicable to realize such a construction that the printed wiring board and the reflecting member are directly adhered to each other at their surfaces that face each other. For example, a resin materialisusedtoformtheprintedwiringboard. Thereflecting member (madeofapartiallyorcompletely-curedresinmaterial) isplacedontheprintedwiringboardmade ofthe resinmaterial in a half-cured state. Subsequently, the printed wiring board andthe reflectingmemberareheated andappliedwithpressure, to be adhered to each other. When this alternative method is employed, the following problems may emerge. The wiring patterns formed in the front surface'of the printed wiring board may be distorted like a wave. Furthermore, a part on the printed wiring board where theLEDdevice is tobemountedmaybe distorted. Theseproblems can be solved in the following manner, for example. The mold used to formthe reflectingmember ±s placed on the reflecting member, which has been placed on the printed wiring board, in such a manner that the protrusions of the mold correspond to the reflecting holes in the reflecting member. In this way, the part of the wiring patterns at which the LED device is to bemountedispressedbythemold, duringtheLEDmountingmodule formation step. In this way, that part of the wiring patterns can be flattened. The reflecting member and the printed wiring board are made of the same resin (an epoxy resin) according to the second embodiment, but can be made of different res±ns. However, it shouldbenotedthatthereflectingmemberandtrieprintedwiring board can be adhered to each othermore strongly when the same resin is used. According to the second embodiment, the resin material oftheprepregs 364 and 368 tobe formedintothe printedwiring board 323 is completely cured during the printed wiring board formation step. As an alternative example, however, the resin materialmaybe onlyhalf curedduringtheprintedwiringboard formation step. The resin material is completely cured when the printed wiring board is adhered to the .reflecting board 326, together with the resin material forming the reflecting board 326 (this method is referred to as post-curing) . If such is the case, the printed wiring board formation step takes a shorter time period. This can improve productivity. According to the first and second embodiments and the like, the LED device is directlymounted on the printed wiring board. However, the LED device can be indirectly mounted on the printed wiring board. This modification is a tenth modification example, where an LED device is mounted on the printed wiring board by using a sub-mounting substrate. Fig. 24 is a cross-sectional view illustrating an LED module relating to the tenthmodification example where an LED device is indirectly mounted. An LED module 600 relating to the tenth modification example uses the same LED mounting module as in the second modification example. This LEDmountingmodule is constituted by the printed wiring board 232 and the reflecting board 126. An LED device 610, included in a sub-mounting device 605, is indirectly mounted on a predetermined location in the LED mounting module. The LED module 600 includes the lens board 130 as in the second modification example. The sub-mountingdevice 605 is, forexample, constituted by a silicon substrate 612 (hereinafter referred, to as an Si substrate 612), the LED device 610 mounted on an upper surface of the Si substrate 612, and a phosphor 618 enclosing the LED device 610 therein.-1Here, the LED device 610 is mounted on the Si substrate 612 through gold bumps 614 and 616. OnalowersurfaceoftheSisubstrate612, afirstterminal electricallyconnectedtooneoftheelectrodesoftheLEDdevice 610 is provided. On the upper surface of the Si substrate 612, asecondterminalelectricallyconnectedtotheotherelectrode of the LED device 610 is provided. Thesub-mountingdevice 605ismountedontheLEDmounting moduleusingasilverpaste, forexample. Thesub-mountingdevice 605 is electrically connected to the printed wiring board 232 inthe followingmanner. Thefirstterminal onthelowersurface oftheSisubstrate612isconnectedtooneofthewiringpattexns 226 in the printed wiring board 232 using a silver paste as mentioned above. Furthermore, the secondterminal on theupper surface ofthe Si substrate 612 is connectedtothe otherwiring pattern 226 in the printedwiringboard 232 through a wire 620. When the LED device 610 is indirectly mounted using a sub-mounting substrate, the sub-mounting device 605 including the phosphor 618 is mounted on the printed wiring board 232. Hence, the sub-mounting device 605 can be mounted on the IED mounting module, after the LED device 610 is tested whetxier to emit light properly, for example. As a result, a yielding ratio of LED modules can be improved, for example. <THIRD EMBODIMENT According to the first and second embodiments, a solid membermade of a resinmaterial inB stage (e.g. the half-cured reflecting board 167a in the first embodiment) is separately- formed, andthenplacedonthemainsurfaceoftheprintedwiring board. Following this, the resin solid member is completely- cured, so as to be adhered to the printed wiring board and to form the reflecting board at the same time. There is, however, an alternative method to form a reflectingmember (indicating reflecting board and pieces) which is directly adhered to the printed wiring board. According to this alternative method, a mold (corresponding to a molding member in the claims) is placed on the main surface of the printed wiring board, and a liquid resin material is then injected into the mold. The following describes such a method that a reflecting board is directly formed on a main surface of a printed wiring board in a single step using a liquid resin material. In a third embodiment, constituents such as a printed wiring board, an LED device and a lens board have the same configurations as their counterparts in the first embodiment, and are therefore indicated by the same reference numerals. The following description is made with focus on how to form a reflecting board 701. (1) FORMING REFLECTING BOARD 701 Fig. 25 is a perspective view illustrating a mold used toformthereflectingboard701relatingtothethirdembodiment. Fig. 26A is a plan view illustrating the mold relating to the third embodiment, and Fig. 26B is a cross-sectional view illustrating the mold along a line DD shown in Fig. 26A in a direction shown by the arrows. As shown in Figs. 25 and 26, a mold 710 is formed like a box which is open at the upper side. A planar shape- of the mold710is substantiallysquareincorrespondencewithaplanar shape of the reflecting board 701 (having the same shape as the reflecting board 126 shown in Fig. 3A) . The mold 710 has abase 711, andsidewalls 712, 713, 714 and715 that are formed at different edges of the base 711 so as to extend vertically. On an internal surface of the base 711, conoidal protrusions 716 are arranged in a matrix of 4 * 4. Ifthereflectingboard701 isformedusingthismold710, the protrusions 716 correspond to reflecting holes 703 in the reflecting board 701. In a top part 716a of each protraction 716, depressions 719a and 719b are formed in correspondence with a part of the printed wiring board 123, which include a portion of the wiring patterns 124 on which the LED device 110 is tobemounted. The depressions 719aand713b aretwo separate depressions, so as to correspond to the anode and cathode of the LED device 110. Fig. 27 is used to explain a reflecting board formation step relating to the third embodiment. To start with, the printed wiring board 123 is kept in apredetermined state, for example, horizontally kept as shown in (a) in Fig. 27. Here, the printed wirirxg board 123 is constitutedbytheinsulationboard122 andt2ie wiringpatterns 124formedonandintheinsulationboard122 (thewiringpatterns formed within the insulation board 122 are not shown in Fig. 27) . Afterthis, theabove-describedmold 7H0 isplacedonthe front (upper) surface of the printedwiring Iboard 123, in such a manner that the base 711 faces away from the front surface of theprintedwiringboard 123. This creates a formation space 718 for the reflecting board 701 between the mold 710 and the printed wiring board 123. Subsequently, a liquid thermoplastic resin material is injected into the mold 710 through an inlet aperture Ilia., and suctioned through an outlet aperture 717b, as shown-1in (b) in Fig. 27. In this way, the thermoplastic resi_n material starts to be poured into the formation space 718 defined by the mold 710 and the printed wiring board 123. When completely filling the formation space 718, the thermoplastic resin material finally flows out through the outlet aperture 717b. This thermoplastic resin material principally includes a polyphthalamide (PPA) resin, and further includes fillers toimprovereflectionefficiency, forexample, TiC>2. Otherthan TiO2/ SiC>2, AI2O3, BaSC>4, orthe likecanbeusedforthefillers. The thermoplastic resin material preferably includes fillers of 0.1 (%) to 50 (%) containing one or more of these fillers. The fillersmaynotbeaddedtothethermoplasticresinmaterial if improvement of reflection efficiency is not required, for example. After the formation space 718 definedbythemold710 and the printed wiring board 123 is filled with the thermoplastic resinmaterial, thethermoplasticresinmaterialiscooleddown, to be cured. Thus, the reflecting board 701 is formed on the front surface of the printed wiring board 123, as shown in (c) in Fig. 27. The reflecting board 701 is adhered to the front surface of the printed wiring board 123, as well as formed. In this way, an LED mounting module 700 is completed. To obtain the liquid thermoplastic resin material, the thermoplastic resin material is heated to 32O0C, for example. However, the temperature varies depending on factors such as atypeofthethermoplasticresinmaterialandviscosityrequired to form the reflecting board 701. Therefore, the temperature needs to be appropriately determined according to the resin material. Fig. 28 illustrates a cross-section of the depressions 719a and 719b in the top part 716a of the protrusion 716 formed in the mold 710, when the mold 710 is placed on the printed wiring board 123. As shownin Figs.25 and28, thedepressions 719aand719b are formed in the top part 716a of the protrusion 716 in the mold 710, in correspondence with the wiringpatterns 124. This canlowerthe riskthatthe liquidthermoplasticresinmaterial flowsintoagapbetweenthetoppart716aandthewiringpatterns 124, when the thermoplastic resin material is injected into the mold 710. For this reason, occurrence of flash caused by the thermoplastic resin material flowing into such a gap can be reduced. The following mentions the dimension of the depression 719a (719b) with reference to Fig. 28. The width Ll (Fig. 28) of the wiring patterns 124, in detail, of a portion of one of the wiring patterns 124 including an electrode (to mount an LEDdevice) is 350 μm. ThewidthL2 (Fig. 28) ofthedepressions 719a and 719b, in detail, of a portion of the depression 719a corresponding to the above-identified portion of the wiring pattern 124 is 360 μm. Which is to say, the depression 719a has a shape correspondingto that of thewiringpattern 124, and a distance of 5 μm is maintained between edges of the depression 719a and the wiring pattern 124. Here, the distance between the edges of the depression 719a and the wiring pattern 124 preferably fallswithina range of 1 μmto 20 μm, taking into consideration the dimensional accuracy of the wiring patterns 124 and the risk of the thermoplastic resin material flowing into the depressions 719a and 719b. The depressions 719a and 719b have a depth greater than a height of the wiring patterns 124 from the front surface of the insulation board 122. To be specific, the wiring patterns 124 have a height of 12 μm, and the depressions 719a and 719b have a depth of 15 μm, so that a distance of 3 μm is provided betweenthe surfaces ofthewiringpatterns 124 andthebottoms of the depressions 719a and 719b. Here, the distance between the surfaces of the wiring patterns 124 and the bottoms of the depressions 719a and 719b is preferably large enough to prevent a contact of the bottoms ofthedepressions 719a and719bwiththe surfaces ofthewiring patterns 124. This is because such a contact may damage the wiring patterns 124. However, an excessively large distance will cause more of the thermoplastic resin material to flow intothegapbetweenthewiringpatterns 124 andthedepressions 719aand719b. Consideringthese, thedistancepreferablyfalls within a range of 1 μm to 15 μm. Byformingthe reflectingboard701 directlyonthe front surface of the printed wiring board 123 in a single step, the productivity of manufacturing LED mounting modules can be improved, when compared with the reflecting board formation methoddescribedinthefirstandsecondembodiments. According to the first and secondembodiments, the half-cured reflecting board (126 and 326) is separately formed, and then placed on theprintedwiringboard (123and323) .Afterthis, thehalf-cured reflecting board (126 and 326) needs to be heated again, to be completely cured. According to the third embodiment, on the other hand, the reflecting board 701 can be almost completed in a single step, which is equivalent to the step of forming the half-cured reflecting board. Note that this single step may take a longer time than the half-cured reflecting board formation step relating to the first and second embodiments, depending on the type of the thermoplastic resinmaterial used to form the reflecting board 701. The reflecting board 701 is formed using the mold 710 in the third embodiment, and therefore has high dimensional accuracy. Accordingly, the reflecting board 701 can reliably reflect light emitted from an LED device in a predetermined direction. (2) MOLD 710 According to the above description, there are two depressions 719aand719binthetoppart 716aoftheprotrusion 716ofthemold710. However, onlyone depressionhavinga shape corresponding to those of the depressions 719a and 719b may be formedinthe toppart 716a. This is describedas an eleventh modification example in the following. Furthermore, one depression having a modified shape may be formed in the top part 716a. This is described as a twelfthmodification example in the following. Fig. 29 is a plan view illustrating a protrusion formed in a mold relating to the eleventh modification example. In Fig. 29, the wiring patterns 124 are indicatedby dashed lines for better intelligibility. In a mold 750, a depression 756 is formed in a top part 754 of a protrusion 752, and has a shape corresponding to the shapes of the two wiring patterns 124 as shown in Fig. 29. In this way, even the single depression 756 in the top part 754 can reduce the amount of a resin material that flows into an area on the printed wiring board 123 in which an LED device istobemounted. Intheeleventhembodiment,thedistancebetween edgesofthedepression756andthewiringpatterns124basically has the same length as the distance mentioned in the third embodiment. Fig. 3OA is a cross-sectional view illustrating a mold relating to the twelfth modification example and the printed wiring board 123, during the formation process of a reflecting board, and Fig. 3OB illustrates a cross-section along a line EE shown in- Fig. 3OA in a direction shown by the arrows. As seen from Fig. 3OB, a depression 766 formed in a top part 762a of a protrusion 762 in a mold 760 has a shape corresponding to the shapes'of the two wiring patterns 124, In addition, the depression 766 is formedwith a periphery 768 beingleftinthetoppart762aoftheprotrusion762. Therefore, the periphery 768 is in contact with the wiring patterns 124, when the mold 760 is placed on the printed wiring board 123. As described above, the depression 766 has a shape corresponding to the portions of the wiring patterns 124 in which an LED device is to be mounted. This reduces the risk of damage to those portions of the wiring patterns 124 during the formation process of the reflecting board. Here, the molds 750 and 760 relating to the eleventh and twelfth modification examples basically have the same configurationas themold710 relatingtothethirdembodiment. Specifically speaking, themolds 750 and 760 respectivelyhave a base and side walls formed at different edges of the base soastoextendvertically. Inaddition, theconoidalprotrusions 752 and 762 are arranged in a matrix of 4 x 4 on an internal surface of the base. <FOϋRTH"EMBODIMENTS According to the third embodiment, the mold 710 is used to form the reflecting board 701. In detail, the mold 710 and the printed wiring board 123 define an enclosed space, and the thermoplastic resin material is injected into this enclosed space. There is, however, an alternative method to form a reflectingboarddirectlyona front surfaceofaprintedwiring board in a single step. The following describes a fourth embodiment, where a reflecting board is formed by printing directlyonafront surfaceofaprintedwiringboardinasingle step. Fig.31Aillustratesamoldusedtoformareflectingboard inthe fourthembodiment, showinga spacetoformthereflecting board, and Fig. 31B illustrates a cross-section of the mold along a line FF shown in Fig. 31A in a direction shown by the arrows. As shown in Fig. 31, a mold 810 relating to the fourth embodiment has a base 811 and side walls 812, 813, 814 and 815 formed at different edges of the base 811 so as to extend vertically. Inaddition, conoidal protrusions 816 are arranged in a matrix of 4 x 4 on an internal surface of the base 811. A depression 818 is formed in a top part 816a of each protrusion 816. Here, the depression 818 is large enough to house an LED device thereinwithout contacting the LEDdevice. In addition, for example, four through holes 820 are provided inthebase811soastosurroundeachprotrusion816. Thethrough holes 820 allow a liquid thermosetting resin material to be injected into the mold 810, when the mold 810 is placed on the printed wiring board 123. A height H2 from the internal surface of the base 811 to the top part 816a is smaller than a height H3 fromthe internal surface of the base 811 to the upper edges of the side walls 812, 813, 814 and 815, by a length equal to the height of the wiring patterns 124. Because of this construction, there is substantially no gap between the side walls 812 to 815 and the printed wiring board 123, when the mold 810 is placed on the front surface of the printedwiring board 123. This can reduce theriskthataliquidthermosettingresinmaterialflowsoutside the mold 810. Thefollowingdescribesaprocedureofformingareflecting board directly onthe front surface of theprintedwiringboard 123 in a single step using this mold 810. Fig. 32 is used to explain a reflecting board formation step relating to the fourth embodiment. In1the thirdembodiment, it is assumedthat anLED device has not been mounted on the printed wiring board 123 before the reflecting board 701 is formed. In the fourth embodiment, on the other hand, it is assumed that the LED device 110 has already been mounted on the printed wiring board 123 before a reflecting board is formed. To start with, the printed wiring board 123 is kept in apredetermined state, for example, horizontally kept as shown in (a) in Fig. 32. Here, the printed wiring board 123 is constitutedbytheinsulationboard 122 andthewiringpatterns 124 formed on the insulation board 122 (the wiring patterns formed within the insulation board 122 are not shown in Fig. 32) . Afterthis, the above-describedmold810 isplaced onthe front (upper) surface of the printedwiringboard 123, in such a manner that the base 811 faces away from the front surface oftheprintedwiringboard 123. This creates a formation space 822 to form a reflecting board between the mold 810 and the printed wiring board 123. Subsequently, a liquid thermosetting resinmaterial 830 is dropped, through the through holes 820, into the formation space 822 as shown in (b) in Fig. 32. The thermosetting resin material 830 principally contains an epoxy resin, and further contains Tiθ2 and the like to improve reflection efficiency, as in the first embodiment. When the formation space 822 is filled with the thermosetting resin material 830 to a certain extent, the thermosetting resin material 830 left on the base 811 of the mold810 isput intotheformationspace 822throughthethrough holes 820 using a squeezee 835, as shown in (c) in Fig. 32. Thus, the formation space 822 is completely filled with the thermosetting resin material 830. When the thermosetting resin material 830 is heated, to be cured, a reflecting board is formed on the front surface of the printed wiring board 123, similarly to (c) in Fig. 27 explaining the third embodiment. It goes without saying that the reflecting board is adhered to the front surface of the printed wiring board 123, as well as formed. Here, it should be noted that the thermosetting resin material 830 is heated at 15O0C for 30 minutes, for example, to be cured. However, the conditions to cure the thermosetting resin material 830 are not limited to such, and can be varied. Fig.33Aisacross-sectionalviewillustratingtheprinted wiring board 123 and the mold 810, when the mold 810 is placed on the printed wiring board 123 to form the reflecting board, and Fig. 33B illustrates a cross-section along a line GG shown in Fig. 33A in a direction shown by the arrows. As seen from Fig. 33, the depression 818 large enough to house the LED device 110 therein is formed in the top part 816a oftheprotrusion816formedinthemold810. Here, thedepression 818 is formedinthecenterofthetoppart816a, withaperiphery left in the top part 816a. Because of this configuration, the periphery of the protrusion 816 is in contact with the wiring patterns 124, when themold 810 is placedon the printedwiring board123. This canreducetheriskthatthethermosettingresin material 830 flows into the depression 818. According to the fourth embodiment, the periphery surrounding the depression 818 in the toppart 816a ofthemold 810issubstantiallyflat, andincontactwiththewiringpatterns 124. Here, the fourth embodiment is not limited to the above description. For example, the configuration of the top part 816a can be modified. The following describes a thirteenth modification example, where the configuration of the top part 816a is modified. Fig. 34A illustrates a mold relating to the thirteenth modification example and the printed wiring board 123, when the mold is placed on the printed wiring board 123 to form a reflecting board, with a part broken away to show an inner structure, and Fig. 34B illustrates the mold and the printed wiring board 123 in a direction H shown in Fig. 34A. Arnold850relatingtothethirteenthmodificationexample has protrusions 852 in correspondence with reflecting holes inareflectingboard. Furthermore, adepression854largeenough to house the LED device 110 therein is formed in a top part 852a of each protrusion 852. Additionally, a second depression 854a is formed in a portion of the top part 852a which opposes the wiring patterns 124 and in which the depression 854 is not formed, as shown in Fig. 34B. A depth H.5 of the second depression 854a is smaller than a height H4 of the wiring patterns 124 from the front surface of the insulation board 122. Because of this configuration, a flat portion of the top part 852a (excluding the depression 854 and the second depression 854a) is positioned between the surfaces of the wiring patterns 124 and the insulation board 122. Here, a width L4 of the second depression 854a is larger than a width L3 of the wiring pattern 124 as shown in Fig. 34B. The difference between the widths L3 and L4 is preferably from 1 μm to 20 μm, as mentioned in the third embodiment. Becauseofthis configuration, theportionofthetoppart 852awhichisincontactwiththeprintedwiringboard123 (wiring patterns 124) is configured so as to coincide with the uneven surface of the printed wiring board 123, excluding a portion of the printed wiring board 123 in which the LED device 110 ismounted. This can reduce the riskthat a thermosetting resin material flows into the depression 854 during the formation process of the reflecting board. Inparticular, the depthH5 of the seconddepression 854a issmallerthantheheightH4 ofthewiringpatterns 124. Because of this configuration, the wiringpatterns 124 canbe reliably made in contact with the bottom of the second depression 854a. In the thirteenth modification example, since the depth H5 is smaller than the height H4, the insulation board 122 is not in contact with the protrusion 852. However, the depth H5 may have substantially the same length as the height H4, so that the printed wiring board 123 (the insulation board 122) is in contact with the top part 852a of the protrusion 852. This can also reduce the risk that the thermosetting resin material flows into the depression 854. In the above description of the fourth embodiment, the reflecting board is formed by printing on the printed wiring board 123 on which the LED device 110 has alreadybeenmounted. To do so, the protrusion 81'6 formed in the mold 810 has the depression 818 to house the LED device 110 therein. However, if the reflecting board is formed by printing in a single step directlyon theprintedwiringboard123 onwhichtheLEDdevice 110 has not been mounted, the protrusion 816 may not need the depression818 large enoughtohousetheLEDdevice 110therein. In this case, the top part 816a of the protrusion 816 may be configured in the same manner as the top part 716a relating to the third embodiment, for example, or may have a depression similar to the depression 756 relating to the eleventh modification example or the depression 766 relating to the twelfth modification example. MODIFICATION EXAMPLES OF THE THIRD AND FOURTH EMBODIMENTS> According to the third and fourth embodiments of the present invention, the reflecting board is formed directly on the printed wiring board in a single step. However, the third andfourthembodimentsarenotlimitedtosuchspecificexamples, and further include the following modification examples. In the following description, "the third and fourth embodiments andthelike" indicatestheeleventhtothirteenthmodification examples basedon thethirdand fourthembodiments, inaddition to the third and fourth embodiments. (1) RESIN MATERIAL According to the third embodiment, the reflecting board is made of a PPA resin. However, the reflecting board can be madeofa different thermoplasticresin suchas apolyphenylene sulfide (PPS) resin, a liquid crystal polymer (LCP), and a polybutylene tereph-thalate (PBT) resin. Furthermore, the reflecting board can be made of a thermosetting resin such as an epoxy resin. According to the fourth embodiment, the reflecting board is made of an epoxy resin. However, the reflecting board can be made of a different resin such as an unsaturatedesterresinandaphenolicresin, orathermoplastic resin as in the third embodiment. (2) LED DEVICE Accordingtothethirdandfourthembodimentsandthelike, the LEDdevice is dixrectlymountedon the printedwiringboard. However, theLEDdevicemaybeindirectlymountedontheprinted wiring board, as in the tenth modification example where the sub-mountingdevice 605 includingtheLEDdevice 610 ismounted on the printed wiring board 232. In this case, the depression formed in the top part of the protrusion needs to have a sufficientlylargesizetohouseasub-mountingdevicetherein. (3) DEPRESSIONS 1. SIZE Accordingtothe fourthembodiment, the reflectingboard is formed after the LED device 110 is mounted on the printed wiringboard 123. However, the reflecting boardmaybe instead formed after a resin member (for example, the phosphor 140 in the first embodiment) is formed by enclosing the LED device 110 mounted on the printed wiring board 123 therein by a resin material. If such is the case, the depression 818 needs to be large enough to house the LED device 110 with the resin member therein. 2. CONFIGURATION OF DEPRESSIONS Accordingtothethirdandfourthembodimentsandthelike, the depression formed in the top part of the protrusion in the mold has a bottom. As an alternative example, however, the depression may be formed as a through hole. In the present description, the depression may have a bottom, or be formed as a through hole without a bottom. The configuration andplanar shape of the depression are notlimitedtothosedisclosedinthethirdandfourthembodiments and the like. (4) REFLECTING BOARD 1. CONSTRUCTION Accordingtothethirdandfourthembodimentsandthelike, the reflectingboard is formedlike aplate, andhas 16 separate reflecting holes in correspondence with the locations where the LED devices are to be mounted, but not limited to such. In other words, it is also possible to provide a separate reflectingpiece for each LED devices, similarlyto the eighth and ninth modification examples based on the first and second embodiments (the reflecting pieces 514 and 534) . Thefollowingdescribesa fourteenthmodificationexample where separate reflecting pieces are provided instead of the reflecting board, with reference to Figs. 35 to 38. Fig.35isaperspectiveviewillustratinganLEDmounting module relating to the fourteenth modification example. As shown in Fig. 35, an LEDmounting module 900 relating to the fourteenth modification example is constituted by a printed wiring board 910 including wiring patterns (not shown in Fig. 35) andapluralityof (16) reflectingpieces 914 formed on a front surface of the printed wiring board 910. As clearly seen from Fig. 35, each reflecting piece 914 has a reflecting hole 916 in its center. In other words, one reflectingpiece914hasonereflectinghole 916. Thereflecting hole 916 is tapered from a front side of the reflecting piece 914 (which faces awayfromtheprintedwiringboard910) toward theprintedwiringboard910,asinthefirsttofourthembodiments and first to thirteenth modification examples. The reflecting piece 914 is formed on the printedwiring board910inthesamemannerasinthethirdandfourthembodiments andthelike. Specificallyspeaking, amoldtoformthereflecting pieces 914 is appropriatelyplaced on the printedwiring board 910. Subsequently, a liquid (thermoplastic or thermosetting) resin material is injected into the mold, and then cured. Fig. 36A is a perspective view illustrating the mold to form the reflecting pieces 914 relating to the fourteenth modification example, and Fig. 36B is a cross-sectional view illustrating the mold along a plane I shown in Fig. 36A in a direction shown by the arrows. As shown in Fig. 36, amold 920 is formed like a box, and has a base 921 and four side walls 922, 923, 924 and 925 (the sidewall 925 isnot showninFig.36, butusedforexplanation), similarly to the mold 810 relating to the fourth embodiment. An'internal spaceofthebox-lzLkemold920 isdividedinto 16 sub-spaces, in total, byhorizontal andvertical walls that extend in horizontal and vertical directions (see X and Y directions in Fig. 21A) and the side walls 922, 923, 924 and 925. Insubstantiallythecenterofeachsub-space, aprotrusion 928 is provided on the base 921, to form the reflecting hole 916 in the reflecting piece 914. A portion in each sub-space in which the protrusion 928 is not formed is a formation space 929 to formthe reflecting piece 914. Note that the protrusion 928 is tapered from the base 921 to the top of the protrusion 928, in correspondence with the shape of the reflecting hole 916. Ineachsub-spaceoftheinnerspaceofthemold920, through holes 930 connected to the formation space 929 are provided inthebase921aroundtheprotrusion928. Throughthesethrough holes930,aliquidresinmaterialcanbepouredintotheformation space 929, when the mold 920 is placed on the printed wiring board 910 to form the reflecting pieces 914. Fig.37isusedtoexplainthestepofformingthereflecting pieces 914 relating to the fourteenth modification example. The printed wiring board 910 is constituted by wiring patterns 913 and an insulation board 912 as shown in (a) in Fig. 37.' Similarly to the third embodiment, no LED device is mounted on the printed wiring board 910. Here, in this printed wiring board 910, depressions 911 are provided at locations where the reflecting pieces 914 are to be adhered, in order to realize stronger connection between the reflecting pieces 914 and the printed wiring board 910. TO be specific, when a resin material is injected to form the reflecting pieces 914, the resin material also flows into the depressions 911. Inthis way, the area at which, each reflecting piece 914 is adhered to the printed wiring board 910 can be increased. When the insulation board 912 is made of a composite material,containing an alumina filler and an epoxy resin, for example, the depressions 911 can be formed using a drill, a laser, or the like, after the epoxy resin is cured. When the insulationboard912ismadeofadifferentmaterial, forexample, a ceramic material, the depressions 911 are formed in the following manner. Through holes are formed by blanking or the like in a green sheet forming a front surface of the printed wiring board 910, and the green sheet is then fired. Toformthereflectingpieces914, theprintedwiringboard 910 is kept inapredeterminedstate, forexample, horizontally kept. After this, the mold 920 is placed on the front (upper) surface of the printed wiring board 910 in such a manner that the base 921 faces away from the front surface of the printed wiring board 910, as shown in (a) in Fig. 37. Subsequently, a liquid thermosetting resin material is dropped onto the base 921 of the mold 920, to be injected into the formation space 929 through the through holes 930. The thermosetting resin material is the same as that used in the fourthembodiment, andisdroppedandinjectedinthesamemanner as in the fourth embodiment. When the formation space 929 is filled with the thermosetting resin material to a certain extent, the thermosetting resin material left on the base 921 of the mold 920 is put into the mold 920 through the through holes 930 by using a squeezee, for example. Thus, the formation space 929 is completelyfilledwiththethermosettingresinmaterial (see Fig. 32) . After the thermosetting resin material in the formation space 929 is heated, to be cured, the mold 920 is removed. In this way, preliminary reflecting pieces 914a, which are to be formed into the reflectingpieces 914, are formed on the front surface of the printed wiring board 910, as shown in (b) in Fig.37.'Here, thepreliminaryreflectingpieces914aareadhered to the front surface of the printed wiring board. 910, as well as formed. Fig. 38 is a perspective view illustrating the printed wiring board 910 on which the preliminary reflecting pieces 914a are formed. As shown in Fig. 38, a top surface (an end surface which facesawayfromtheprintedwiringboard910) ofeachpreliminary reflecting piece 914a includes projections 914b, due to the resin material filling the through holes 930 in the mold 920. Following this, a step of removing the projections 914b of the preliminary reflecting piece 914a is performed. In "this step, theprojections 914bareremovedbygrinding, forexample, using a grinding stone or the like. Thus, the preliminary reflecting pieces 914a have an even height. As shown in Fig. 37, the depressions 911 are provided at locations, intheprintedwiringboard910, wherethereflecting pieces 914 are to be formed. The resin material to form, the reflecting pieces 914 also flows into the depressions 91L, to formportions 915a. Here, the portions 915a are'adhered to the reflecting pieces 914. This can achieve stronger connection between the reflectingpieces 914 and the printedwiring board 910. According to the fourteenth modification example, the reflecting pieces 914 are formed on the printed wiring board 910 before the LED devices are mounted . However, the reflecting pieces 914 can be formed in ' the same manner as in the fourth embodiment, where the reflecting board is formed on the pr÷Lnted wiring board 123 , on which the LED devices 110 have alrready been mounted . Thefollowingdescribesafifteenthmodificationexample, where separatereflectingpieces are formedonaprintedwiring board, on which LED devices have already been mounted. Fig. 39 is a cross-sectional view illustrating a mold relating to the fifteenth modification example and a printed wiring board, when the mold is placed on the printed wiring board. As shown in Fig. 39, a printed wiring board 960 is constitutedbyaninsulationboard 962 andwiringpatterns 963. Here, theLEDdevices110havealreadybeenmountedontheprinted wiring board 960. Therefore, a depression 981 large enough to house the LED device 110 therein is formed in a protrusion 978 in a mold 950 relating to the fifteenth modification example, similarly to the protrusion 816 in the mold 810 relating to the fourth embodiment. By placing the mold 950 on the printed wiringboard960, aformationspace979toformreflectingpieces is defined between the mold 950 and the printed wiring board 960. Becauseofthemold950havingthisconfiguration, separate reflecting pieces can be formed on the printed wiring board 960 on which the LED devices 110 have already been mounted. Depressions 961 areprovidedinthe insulationboard962, as inthe fourteenthmodification example. Here, the fifteenth modification example can be realized without the depressions 961. However, the depressions 961 can achieve stronger connectionbetweenthereflectingpiecesandtheprintedwiring board 960, as mentioned above. 2. CONDITIONS UNDERWHICHREFLECTINGBOARDORPIECESARE FORMED Theabovedescriptionofthethirdandfourthembodiments and the eleventh to fifteenth modification examples does not particularlymentionthe conditionsunderwhichthe reflecting member (indicating the reflectingboardandpieces) is formed. The reflecting member is preferably formed under vacuum. In thisway, airintheliquidresinmaterialtoformthereflecting member can be evacuated, and fewer voids are created in the completed reflecting member. An appropriate degree of vacuum varies dependingontheviscosityofthe liquidresinmaterial, the shape ofthe reflectingmember, the shape of the reflecting holes, andthereforeneedstobedeterminedbasedonexperiments and the like. Generally speaking, however, a favorable reflecting member can be obtained under vacuum of 100 (Pa) or less. (5) FLASHOBSERVED DURING PROCESS OF FORMINGREFLECTINGMEMBER Theabovedescriptionofthethirdandfourthembodiments and the eleventh to fifteenth modification examples does not particularly mention how to remove flash created due to the gap between the mold and the printed wiring board during the stepofformingthereflectingmember. Suchflashcanberemoved bygridblasting (sandblasting), forexample, inwhichparticles are forcibly sprayed. The particles used in sandblasting include particles of glass, silicone, phenol, nylon, polycarbonate, melanin, urea, polyester, and the like. An average par~ticle diameter is preferably 0.05 mm to 3.0 mm approximately, and the pressure at whichtheparticles are sprayed is appropriatelydetermined based on factors such as the thickness of the flash. <FURTHER MODIFICATIONS> The present invention is described "with reference to the first to fourth embodiments and the first to fifteenth modification examples basedthereon, but not limitedto those. The present invention further includes the following modification examples. (1) INSULATION BOARD According to the first to fourth embodiments, the insulationboard constituting the printedwiringboard is made of a ceramic material or a composite material containing an aluminafillerandanepoxyresin, butcanbemadeofadifferent material. For example, an alumina filler may be replaced with a different inorganic filler such as SiO2 andAlN, and an epoxy resincanbereplacedwitha differentthermosettingresin such as a bismaleimide-triazine (BT) resin. In addition, the insulation board may be made of a thermosettingresinmaterial, containingathermosettingresin such as an epoxy resin and a BT resin, and a glass fiber. Note that the resin materials mentioned in the present descriptionindicatearesinmaterialcontaininganepoxyresin, a BT resin, or the like principally, and a different component additionally. (2) WIRING PATTERNS According to the first embodiment, the wiring patterns 124 are'formed by printing and firing the conductive paste. According to the second embodiment, the wiring patterns 324 and 325 are formed by photolithography. However, the wiring patterns can be formed using a different method, which is presented in the following as an example. The front surface of the insulation board is masked except for apart inwhichthewiringpatterns aretobe formed. Afterthis, ametal filmmadeofnickel, platinum, gold, silver, copper, palladium, or the like is formed by sputtering, deposition or the like, thereby acquiring the wiring patterns formed by the metal film. (3) THE NUMBER OF LED DEVICES According to the first to fourth embodiments, the LED devices are arranged in amatrix of 4 x 4. However, the present invention is not limited to such. Furthermore, in a case where separate reflecting pieces are respectively provided for the LEDdevices, thenumberandarrangementofthereflectingpieces varyinaccordancewiththechangeinthenumberandarrangement of the LED devices. (4) REFLECTING MEMBER Accordingtotheeighth,ninthandfourteenthmodification examples, the separate reflecting pieces (514, 534 and 914) areprovidedinaone-to-onecorrespondencewiththeLEDdevices 110. However, it is also possible to use a reflecting piece corresponding to a predetermined number of LED devices, out of all the LED devices. Which is to say, multiple reflecting pieces each of which has a predetermined number of reflecting holes may be separately formed on the printed wiring board. Specificallyspeaking, four reflectingpieces eachhaving four reflecting holes can be formed, for example. Furthermore, there is no limitation to the number of reflecting holes (516, 536 and 916) in each reflecting piece (514, 534 and 914) . In detail, the number of reflecting holes (516, 536 and 916) may be the same or different in each of the reflecting pieces (514, 534 and 914) . Alternatively, the reflecting pieces (514, 534 and 914) may be grouped depending on the number of reflecting holes (516, 536 and 916) therein. Furthermore, the shape of the reflecting hole (516, 536 and 916) may be the same or different in each of the reflecting pieces (514, 534 and914). Alternatively, thereflectingpieces (514, 534 and 914) may be grouped depending on their shape. The separate reflecting pieces (514, 534 and 914) have an advantage that less distortion is caused in the reflecting member a'ndtheprintedwiringboardbyheat, when comparedwith the reflecting board 126 relating to the first embodiment, for example. Suchdistortioniscausedduetoadifferenceinthermal expansioncoefficientbetweenmaterials formingthereflecting member and the printed wiring board. (5) OTHER MATTERS According to the first to fourth embodiments, the wall ofthe reflectinghole is expressedbya substantiallystraight line in the cross-section of the reflecting board, when seen in a direction perpendicular to the cross-section. However, the present invention is not limitedto such. As an alternative example, in its cross-section, the wall may be expressed by a curved line such as aparabolic line, andapart of anellipse (includinga circle) . This modification canbe easilyrealized byusingamoldwithprotrusionswhicheachhaveacurvedexternal surface, in terms of its cross-section. Here, it is preferable that the protrusions have a smaller diameter at its top than at its base, considering that the half-cured reflecting board is taken out of the mold. Accordingtothe secondembodiment, the reflectingboard and the printed wiring board are made of the same resin (an epoxy resin) . However, the reflecting board and the printed wiringboardcanbemadeofdifferentresins. Notethat, however, the same resin can achieve stronger connection between the reflecting board and the printed wiring board. When the printed wiring board is made up by a plurality of layers as in the second embodiment, for example, at least a front layer, that is to say, a layer in contact with the reflecting board, is preferably made-1Of the same resin as the reflecting board. The above description is made under assumption that the LEDmountingmodules areusedina lightingapparatus. However, theLEDmountingmodules canbealsousedinadisplayapparatus which achieves display of information by selectively causing a plurality of LED devices to emit light, that is to say, a displayapparatusinwhicheachlightemittingdeviceisamounted as one dot. The above embodiments andmodification examples case the LEDdevicesforlightemittingdevices,butcanalsousedifferent types of semiconductor light emitting devices such as laser diodes. The first to fourth embodiments, the first to fifteenth modificationexamples, andthemodificationexamplesdes cribed in this section may be freely combined. This application is basedonapplications No. 2004—93896 andNo.2005-64801filedinJapan, thecontentofwhichisIhereby incorporated by reference.

INDUSTRIAL APPLICABILITY The present invention canprovide anLEDmountingmodule whichcanachievefavorablelightextractionefficiencywzLthout increasing a cost.