LED MOUNTING MODULE, LED MODULE, MANUFACTURING METHOD OF LED MOUNTING MODULE, AND MANUFACTURING METHOD OF LED MODULE

WIPO Patent Application WO2005093862

A3

The following explains an LED module that can achieve favorable light extraction efficiency without increasing a cost. An LED module (100) includes LED devices (110), an LED mounting module (120) on which the LED devices (110) are mounted, and a lens board (130) attached to a front surface of the LED mounting module (120). The LED mounting module (120) includes a printed wiring board (123) and a reflecting board (126). The printed wiring board (123) is an insulation board (122) on which a wiring pattern (124), used to mount the LED devices (110), is formed. The reflecting board (126) is made of a resin material, and has therein reflecting holes (126a) provided in correspondence with locations, on the printed wiring board (123), where the LED devices (110) are mounted. The reflecting board (126) and the printed wiring board (123) are directly adhered to each other at their surfaces that face each other.

NISHIMOTO KEIJI
NAGAI HIDEO

PCT/JP2005/005603

April 27, 2006

March 18, 2005

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MATSUSHITA ELECTRIC IND CO LTD (JP)
NISHIMOTO KEIJI
NAGAI HIDEO

F21S2/00; H01L33/48; H01L33/50; H01L33/54; H01L33/56; H01L33/60; H01L33/62; F21Y101/02; H01L25/075

US20040047151A1	2004-03-11
US20030141510A1	2003-07-31
DE19945919A1	2000-03-30
EP1087447A1	2001-03-28
EP1267423A2	2002-12-18
EP1246265A2	2002-10-02
US5283425A	1994-02-01
US5660461A	1997-08-26

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