Title:
LED SUBSTRATE MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/090314
Kind Code:
A1
Abstract:
To unify a configuration for heat dissipation and a configuration for mounting an LED substrate and to facilitate mounting of the LED substrate while increasing heat dissipation efficiency, the disclosed LED substrate mounting device has a lower frame (A) that has a support surface for the LED substrate (B) and lower side walls (2) at the lower parts in the longitudinal direction thereof on both sides, an upper frame (C) that is affixed to said lower frame (A), and the LED substrate (B) that is disposed on the upper surface of the lower frame (A). Both sides of the LED substrate (B) in the longitudinal direction are clamped by the upper surface of the lower frame (A) and a surface (4) formed on the upper frame (C) facing the upper surface of the lower frame (A). The LED substrate (B) is made to have heat conductivity. Both frames (A) and (C) are configured from good heat conductors and heat generated by the LED chip is dissipated via the frames (A) and (C).
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Inventors:
KOBAYASHI KIYOYASU (JP)
GEMMA KAZUTOSHI (JP)
GEMMA KAZUTOSHI (JP)
Application Number:
PCT/JP2010/051792
Publication Date:
August 12, 2010
Filing Date:
February 08, 2010
Export Citation:
Assignee:
KENOS SPATIAL DESIGN INC (JP)
KOBAYASHI KIYOYASU (JP)
GEMMA KAZUTOSHI (JP)
KOBAYASHI KIYOYASU (JP)
GEMMA KAZUTOSHI (JP)
International Classes:
F21V19/00; F21S2/00; F21V29/00; F21Y101/02
Foreign References:
| JP2002093206A | 2002-03-29 | |||
| JP2007035788A | 2007-02-08 |
Attorney, Agent or Firm:
MINE Tadao (JP)
Peak Tadao (JP)
Peak Tadao (JP)
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