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Patent Searching and Data


Title:
LEVELER, LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN MICROELECTRONICS
Document Type and Number:
WIPO Patent Application WO/2016/106543
Kind Code:
A1
Abstract:
The present disclosure relates to a leveling compound for electrodepositing metals. The compound is of formula (I) or a salt thereof:

Inventors:
ZHANG YUN (US)
MA TAO (CN)
DONG PEIPEI (CN)
ZHU ZIFANG (CN)
CHEN CHEN (CN)
Application Number:
PCT/CN2014/095492
Publication Date:
July 07, 2016
Filing Date:
December 30, 2014
Export Citation:
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Assignee:
SUZHOU SHINHAO MATERIALS LLC (CN)
International Classes:
C07D311/84; C25D3/38
Foreign References:
US2776299A1957-01-01
CN103924269A2014-07-16
CN103924268A2014-07-16
CN102953097A2013-03-06
Other References:
BROUILLETTE, G. ET AL.: "Soft Drugs. 21. Design and Evaluation of Soft Analogs of Propantheline", JOURNAL OF PHARMACEUTICAL SCIENCES, vol. 85, no. 6, 30 June 1996 (1996-06-30), pages 619 - 623
BUCHWALD, PETER ET AL.: "Soft Quaternary Anticholinergics: Comprehensive Quantitative Structure - Activity Relationship (QSAR) with a Linearized Biexponential (LinBiExp) Model", JOURNAL OF MEDICINAL CHEMISTRY, vol. 49, no. 3, 10 January 2006 (2006-01-10), pages 883 - 891
Attorney, Agent or Firm:
CHINABLE IP (35-10-2 the 6th floor, No.35 Anding Road, Chaoyang District, Beijing 9, CN)
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