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Title:
LIGHT DETECTION DEVICE, METHOD FOR MANUFACTURING LIGHT DETECTION DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/057739
Kind Code:
A1
Abstract:
Provided is a light detection device that can reduce the number of steps for a pixel separation part and reduce light scattering in a pixel structure forming an on-chip lens for each of a plurality of pixels. The light detection device comprises a semiconductor substrate, a pixel separation part, and an on-chip lens. The pixel separation part is provided on the semiconductor substrate and separates adjacent pixels from each other. The on-chip lens is disposed in every pixel group composed of two or more pixels on a light incident surface side of the semiconductor substrate, and condenses light from outside onto the pixel groups. The pixel separation part includes an intra-pixel group separation part disposed between adjacent pixels of the pixel groups and having a first dug region extending in the thickness direction of the semiconductor substrate, and a second dug region differing from the first dug region at a position where light is condensed by the on-chip lens. In the intra-pixel separation part, the width of the second dug region is formed narrower than the width of the first dug region in a plan view.

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Inventors:
KODAMA YOSHINORI (JP)
HONDA TAKAYOSHI (JP)
INOUE TOSHINORI (JP)
Application Number:
PCT/JP2023/027645
Publication Date:
March 21, 2024
Filing Date:
July 27, 2023
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N25/70
Domestic Patent References:
WO2020262643A12020-12-30
WO2018221443A12018-12-06
WO2021193915A12021-09-30
WO2021193254A12021-09-30
Foreign References:
JP2017212351A2017-11-30
US20200243578A12020-07-30
US20220109015A12022-04-07
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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