LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE, LIGHT SOURCE DEVICE, AND LAMP

WIPO Patent Application WO/2022/176574

A1

A light emitting device comprising: a substrate having circuit wiring; a semiconductor light emitting element mounted on the substrate; a frame vertically provided on the substrate in an annular or oval-annular shape so as to surround the semiconductor light emitting element; and an enclosure enclosing an inner wall of the frame, an upper surface of the substrate on the inside of the frame, and the semiconductor light emitting element. The enclosure includes: a first resin portion having a concave surface comprising at least one rotational plane having the central axis of the frame as a rotational axis; and a second resin portion covering the concave surface of the first resin portion and having a convex external surface. The enclosure has an external surface in which the external surface of the first resin portion and the external surface of the second resin portion are integrated.

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JP5224173	Semiconductor light emitting device
JP2006324324	LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING SAME, AND SEMICONDUCTOR SUBSTRATE

SHIBUSAWA SOICHI (JP)
KANBARA DAIZO (JP)

PCT/JP2022/003406

August 25, 2022

January 28, 2022

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STANLEY ELECTRIC CO LTD (JP)

H01L33/54; F21S41/143; F21V5/00; H01L33/58

JP2016195099A	2016-11-17
JP2015015404A	2015-01-22
JP2007180339A	2007-07-12
JP2003234511A	2003-08-22
JP2003234008A	2003-08-22
JP2019149282A	2019-09-05
JP2017059795A	2017-03-23
JP2015023219A	2015-02-02
JP2011228408A	2011-11-10
CN101494259A	2009-07-29
JP2007242246A	2007-09-20
JP2000156528A	2000-06-06
JP2016195099A	2016-11-17
JP2019106259A	2019-06-27
JP2019149282A	2019-09-05

SATO & ASSOCIATES (JP)

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