Title:
LIGHT EMITTING DIODE FILAMENT
Document Type and Number:
WIPO Patent Application WO/2019/093713
Kind Code:
A1
Abstract:
A light emitting diode filament comprises: a substrate having a first surface and a second surface which are opposite to each other, and extending in one direction; at least one light emitting diode chip provided on the first surface; and an auxiliary pattern provided on the second surface while being disposed at a position corresponding to the light emitting diode chip.
Inventors:
PARK JAE HYUN (KR)
LEE SEONG JIN (KR)
LEE JONG KOOK (KR)
LEE SEONG JIN (KR)
LEE JONG KOOK (KR)
Application Number:
PCT/KR2018/013156
Publication Date:
May 16, 2019
Filing Date:
November 01, 2018
Export Citation:
Assignee:
SEOUL SEMICONDUCTOR CO LTD (KR)
International Classes:
H01L25/075; H01L33/36; H01L33/50; H01L33/58
Foreign References:
| KR20170119503A | 2017-10-27 | |||
| JP2014026757A | 2014-02-06 | |||
| KR20110043992A | 2011-04-28 | |||
| US20170130906A1 | 2017-05-11 | |||
| KR20170103068A | 2017-09-13 |
Other References:
See also references of EP 3709354A4
Attorney, Agent or Firm:
LEE, Ki Sung (KR)
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