Title:
LIGHT EMITTING DIODE PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2011/079545
Kind Code:
A1
Abstract:
A LED packaging structure is provided, which includes: a cavity (21), a metal shell (2) with two opening ends, a two-phase flow heat conducting device (4) with a mounting plane (41); a lens (3) is fixed at a first opening end of the metal shell (2); at least one LED chip (1) is located in the cavity (21) of the metal shell (2) and fixed on the mounting plane (41) of the two-phase flow heat conducting device (4); an external electric connection device (5) is connected with the LED chip (1); a fixing seat (6) is fixed with the two-phase flow heat conducting device (4), the external electric connection device (5) and the LED chip (1). By adopting a two-phase flow heat conducting device, the structure can work continuously for a long time, and has long service life and high light emitting efficiency.
Inventors:
LEE KECHIN (CN)
Application Number:
PCT/CN2010/070629
Publication Date:
July 07, 2011
Filing Date:
February 11, 2010
Export Citation:
Assignee:
ZHONGSHAN WEIQIANG TECHNOLOGY CO LTD (CN)
LEE KECHIN (CN)
LEE KECHIN (CN)
International Classes:
H01L33/00; H01L23/427; H01L23/467; H01L23/473
Foreign References:
| JP2007173874A | 2007-07-05 | |||
| CN101315927A | 2008-12-03 | |||
| CN100468795C | 2009-03-11 | |||
| CN101222006A | 2008-07-16 |
Attorney, Agent or Firm:
JIAQUAN IP LAW FIRM (CN)
广州嘉权专利商标事务所有限公司 (CN)
广州嘉权专利商标事务所有限公司 (CN)
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