Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LIGHT-RECEIVING MODULE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/248409
Kind Code:
A1
Abstract:
The present disclosure pertains to a light-receiving module (100) and a manufacturing method therefor. The purpose of the present disclosure is to provide: a light-receiving module (100) in which a light-receiving element (10) can be disposed at a suitable position relative to a stem (1); and a manufacturing method therefor. This light-receiving module (100) comprises: a light-receiving element (10); a dielectric substrate (5) on which the light-receiving element (10) is mounted and which has two recesses (6); and a stem (1) in which two output lead pins (3a, 3b) are sealed in through-holes. The two recesses (6) are physically in contact with the two output lead pins (3a, 3b).

More Like This:
JP2019165068OPTICAL SEMICONDUCTOR MODULE AND MANUFACTURING METHOD OF THE SAME
WO/2018/220934EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Inventors:
FUJIHARA RYOTA (JP)
Application Number:
PCT/JP2022/025037
Publication Date:
December 28, 2023
Filing Date:
June 23, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L31/02
Domestic Patent References:
WO2021014568A12021-01-28
WO2021001914A12021-01-07
WO2021166215A12021-08-26
WO2019176912A12019-09-19
Foreign References:
JP2007042756A2007-02-15
JP2019186379A2019-10-24
JP2019515492A2019-06-06
JP2001185799A2001-07-06
JP2007150241A2007-06-14
JP2007073664A2007-03-22
JP2007201213A2007-08-09
US20110122905A12011-05-26
Attorney, Agent or Firm:
TAKADA, TAKAHASHI & PARTNERS (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING PROGRAM

Next Patent: ELEVATOR APPARATUS