Title:
LIGHT-TRANSMITTING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2006/109768
Kind Code:
A1
Abstract:
Disclosed is a light-transmitting resin composition containing an epoxy resin having an alicyclic epoxy group and an aluminum chelate compound. A preferred embodiment of this resin composition further contains a dicarboxylic acid component. This resin composition hardly suffers from yellowing when irradiated with light, and is excellent in heat resistance. Consequently, the resin composition is suitable as a sealing resin for light-emitting diodes.
Inventors:
YAMAMOTO YASUO (JP)
Application Number:
PCT/JP2006/307560
Publication Date:
October 19, 2006
Filing Date:
April 10, 2006
Export Citation:
Assignee:
ABLESTIK JAPAN CO LTD (JP)
YAMAMOTO YASUO (JP)
YAMAMOTO YASUO (JP)
International Classes:
C08G59/70; C08G59/24; H01L23/29; H01L23/31; H01L33/56
Foreign References:
| JPH059268A | 1993-01-19 | |||
| JPH06100762A | 1994-04-12 | |||
| JPH0725987A | 1995-01-27 | |||
| JP2005171187A | 2005-06-30 |
Attorney, Agent or Firm:
Shamoto, Ichio (Section 206 New Ohtemachi Bldg., 2-1,
Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, JP)
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