Title:
LIQUID COMPOSITION, METAL FILM, CONDUCTIVE WIRING LINE, AND METHOD FOR PRODUCING METAL FILM
Document Type and Number:
WIPO Patent Application WO/2013/145953
Kind Code:
A1
Abstract:
Provided is a metal film which has less voids and good electrical conductivity, while exhibiting good adhesion to a base.
A liquid composition which contains: (a) a mixture of (i) an organic metal compound and (ii) at least one compound that is selected from the group consisting of aliphatic amines and aliphatic thiols, in said mixture the molar ratio of the content of the component (ii) to the content of the component (i), namely (ii)/(i), being 0.9-1.2; (b) metal oxide particles; and (c) a solvent.
Inventors:
YASUDA TAKAYASU (JP)
Application Number:
PCT/JP2013/054175
Publication Date:
October 03, 2013
Filing Date:
February 20, 2013
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B1/22; C22B5/02; C23C18/14; H01B5/14; H01B13/00; H05K1/09; C09D11/00
Foreign References:
| JP2010176976A | 2010-08-12 | |||
| JP2010528428A | 2010-08-19 | |||
| JP2007197755A | 2007-08-09 | |||
| JP2007332422A | 2007-12-27 | |||
| JP2011238737A | 2011-11-24 | |||
| JP2012131894A | 2012-07-12 |
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)
Takamatsu 猛 (JP)
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