LIQUID COMPOSITION, COPPER METAL FILM, CONDUCTIVE WIRING LINE, AND METHOD FOR PRODUCING COPPER METAL FILM

Title:

LIQUID COMPOSITION, COPPER METAL FILM, CONDUCTIVE WIRING LINE, AND METHOD FOR PRODUCING COPPER METAL FILM

Document Type and Number:

WIPO Patent Application WO/2013/145954

Kind Code:

A1

Abstract:

Provided is a copper metal film which has less voids and good electrical conductivity, while exhibiting good adhesion to a base. A liquid composition which contains (a) at least one substance that is selected from the group consisting of formic acid and copper formate, (b) copper oxide particles and (c) a solvent.

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Inventors:

YASUDA TAKAYASU (JP)

Application Number:

PCT/JP2013/054176

Publication Date:

October 03, 2013

Filing Date:

February 20, 2013

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

H01B13/00; C23C18/14; H01B1/22; H01B5/14; H05K1/09

Foreign References:

JP2010176976A	2010-08-12
JP2010528428A	2010-08-19
JP2007197755A	2007-08-09
JP2007332422A	2007-12-27

Attorney, Agent or Firm:

TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)

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