Title:
LIQUID COMPOSITION, PREPREG, RESIN-INCLUDING METAL SUBSTRATE, WIRING BOARD, AND SILICA PARTICLES
Document Type and Number:
WIPO Patent Application WO/2023/199802
Kind Code:
A1
Abstract:
Provided are: a liquid composition containing a thermosetting resin and silica particles, wherein (1) the silica particle d50 and specific surface area are in specific ranges, and the composition viscosity is in a specific range, (2) the silica particle d50, and the product of the d50 and specific surface area are in specific ranges, and a solvent having a specific surface tension is further included, (3) the silica particle d50/d10 is in a specific range, a solvent having a specific boiling point and evaporation rate is further included, and the composition thixotropic ratio is in a specific range, or (4) the proportion of silica particles having a particle size of 10 μm or more, and the silica particle size variation coefficient and d50 are in specific ranges; and a usage thereof.
Inventors:
KAMO HIROMICHI (JP)
Application Number:
PCT/JP2023/014000
Publication Date:
October 19, 2023
Filing Date:
April 04, 2023
Export Citation:
Assignee:
AGC INC (JP)
AGC SI TECH CO LTD (JP)
AGC SI TECH CO LTD (JP)
International Classes:
C08L101/00; B32B5/28; B32B15/08; B32B15/20; B32B27/20; B32B27/24; C01B33/18; C08J5/24; C08K3/36; C08K5/03; C08K5/07; C08K5/3415; C08K7/02; C08L25/02; C08L63/00; C08L71/12; H05K1/03
Foreign References:
| JP2021187969A | 2021-12-13 | |||
| JP2015036357A | 2015-02-23 | |||
| JP2017135053A | 2017-08-03 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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