Title:
LIQUID COMPOSITION, PREPREG, RESIN-INCLUDING METAL SUBSTRATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/199803
Kind Code:
A1
Abstract:
Provided are: a liquid composition including a thermosetting resin, first silica particles, second silica particles, and a solvent, wherein the first silica particles have a median size d50 of 1.5 to 20.0 μm, with the product of the median size d50 and specific surface area being 2.7 to 5.0 μm·m2/g, and the second silica particles have a median size d50 of at least 0.3 μm but less than 1.5 μm; and a prepreg, a resin-including metal substrate, and a wiring board that use the liquid composition.
Inventors:
KAMO HIROMICHI (JP)
Application Number:
PCT/JP2023/014001
Publication Date:
October 19, 2023
Filing Date:
April 04, 2023
Export Citation:
Assignee:
AGC INC (JP)
AGC SI TECH CO LTD (JP)
AGC SI TECH CO LTD (JP)
International Classes:
C08L101/00; B32B15/08; B32B15/20; B32B27/20; B32B27/24; C08J5/04; C08K3/36; C08L25/02; C08L63/00; C08L71/12; H05K1/03
Domestic Patent References:
| WO2017195344A1 | 2017-11-16 |
Foreign References:
| JP2019167426A | 2019-10-03 | |||
| JP2013173841A | 2013-09-05 | |||
| JP2015079787A | 2015-04-23 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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