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Patent Searching and Data


Title:
LIQUID TREATMENT SYSTEM AND LIQUID TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2005/117081
Kind Code:
A1
Abstract:
The front surface of a substrate (W) under stationary state is excellently cleaned by supplying a treatment liquid by suppressing spilling of the treatment liquid to the rear surface side of the substrate. To carry out a specified treatment by supplying the treatment liquid to the substrate held horizontally at a substrate holding part, for example, a cleaning liquid is ejected from an ejection opening (4) facing the rear surface of the substrate over the entire circumference, before the treatment liquid is supplied. The cleaning liquid supplied to the rear surface side of the substrate and the liquid spilling from the front surface of the substrate are sucked by a first suction means having a suction opening (44) facing the rear surface of the substrate over the entire circumference, thus forming a flow of the cleaning liquid flowing along the rear surface of the substrate, for example, outward from the inside. In this case, since the liquid spilling from the front surface side to the rear surface side of the substrate can be suppressed, for example, without relying upon rotational liquid draining, the substrate can be cleaned well.

Inventors:
NISHIKIDO SHUUICHI (JP)
Application Number:
PCT/JP2005/006260
Publication Date:
December 08, 2005
Filing Date:
March 31, 2005
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
NISHIKIDO SHUUICHI (JP)
International Classes:
B08B3/02; B08B7/04; H01L21/00; H01L21/027; H01L21/304; B08B5/04; (IPC1-7): H01L21/304; B08B3/02; B08B5/04; B08B7/04; H01L21/027
Foreign References:
JP2003007664A2003-01-10
JP2001319849A2001-11-16
JP2004022783A2004-01-22
Attorney, Agent or Firm:
Yoshitake, Kenji (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo 05, JP)
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