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Title:
LOOP HEAT PIPE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/203574
Kind Code:
A1
Abstract:
A loop heat pipe (1) is formed to have a structure in which a first plate-like member (8) and a second plate-like member (9) are joined. The first plate-like member is formed to have: a first recess (10) in a region forming an evaporator (2), a region forming a condensation pipe (3A) that constitutes a condenser (3), a region forming a steam pipe (4), and a region forming a liquid pipe (5); and grooves (11) that can cause a capillary force, in the region forming the evaporator. The second plate-like member is formed to have a second recess (12) in a region forming the evaporator, a region forming the condensation pipe, a region forming the steam pipe, and a region forming the liquid pipe. A porous structure (13) is provided in the second recess.

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Inventors:
SHIOGA TAKESHI (JP)
ABE TOMOYUKI (JP)
Application Number:
PCT/JP2016/065194
Publication Date:
November 30, 2017
Filing Date:
May 23, 2016
Export Citation:
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Assignee:
FUJITSU LTD (JP)
International Classes:
F28D15/02; F28D15/04; H01L23/427; H05K7/20
Domestic Patent References:
WO2015087451A12015-06-18
WO2012046338A12012-04-12
Foreign References:
JP2015059693A2015-03-30
JP2016090204A2016-05-23
US20100044014A12010-02-25
JP2015183880A2015-10-22
JP2009109079A2009-05-21
JP2008281275A2008-11-20
JP2016075437A2016-05-12
Attorney, Agent or Firm:
SANADA, Tamotsu et al. (JP)
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