Title:
LOUDSPEAKER MODULE
Document Type and Number:
WIPO Patent Application WO/2023/193320
Kind Code:
A1
Abstract:
The present invention provides a loudspeaker module. The loudspeaker module of the present invention comprises a housing having an accommodation space, a vibration system accommodated in the accommodation space, and a magnetic circuit system accommodated in the accommodation space to drive the vibration system to vibrate and produce sound. The housing comprises a supporting frame having a through cavity, a front cover installed on the opening side of the through cavity of the supporting frame and a rear cover installed on the side of the supporting frame deviating from the front cover. A positioning structure is arranged on the inner side of the supporting frame, the vibration system is fixed to the side of the positioning structure close to the front cover, and the magnetic circuit system is fixed to the side of the positioning structure close to the rear cover. A front cavity is formed between the vibration system and the front cover, and the vibration system, the supporting frame and the rear cover enclose a rear cavity. The supporting frame comprises a conductive member integrally injection molded therein, one end of the conductive member is exposed in the through cavity and electrically connected to the vibration system, and the other end of the conductive member is exposed outside the supporting frame. The solution can simplify a manufacturing process and an assembly process of the loudspeaker module, and reduce the application cost.
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Inventors:
YANG HAIJUAN (CN)
WANG LEI (CN)
WU SHUWEN (CN)
WANG LEI (CN)
WU SHUWEN (CN)
Application Number:
PCT/CN2022/090941
Publication Date:
October 12, 2023
Filing Date:
May 05, 2022
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC MICROTECH CHANGZHOU CO LTD (CN)
AAC MICROTECH CHANGZHOU CO LTD (CN)
International Classes:
H04N5/00; H04R9/08
Foreign References:
| CN210093509U | 2020-02-18 | |||
| CN209897263U | 2020-01-03 | |||
| CN208638694U | 2019-03-22 | |||
| CN206542569U | 2017-10-03 | |||
| CN204465855U | 2015-07-08 | |||
| US20200275210A1 | 2020-08-27 |
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY FIRM (CN)
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