LOW DIELECTRIC RESIN COMPOSITION, ADHESIVENESS IMPARTING AGENT, LOW DIELECTRIC ADHESIVE COMPOSITION, LOW DIELECTRIC ADHESIVE MOLDED ARTICLE, LOW DIELECTRIC ADHESIVE AND MULTILAYER BODY

Title:

LOW DIELECTRIC RESIN COMPOSITION, ADHESIVENESS IMPARTING AGENT, LOW DIELECTRIC ADHESIVE COMPOSITION, LOW DIELECTRIC ADHESIVE MOLDED ARTICLE, LOW DIELECTRIC ADHESIVE AND MULTILAYER BODY

Document Type and Number:

WIPO Patent Application WO/2024/038794

Kind Code:

A1

Abstract:

This low dielectric resin composition contains a polyolefin resin. The polyolefin resin contains a styrene elastomer (A) and a cyclic olefin polymer (B) that has an alicyclic ring in the main chain. The content ratio of the styrene elastomer (A) is 30 parts by mass to 89 parts by mass relative to a total of 100 parts by mass of the styrene elastomer (A) and the cyclic olefin polymer (B).

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Inventors:

SAKAMOTO NATSUKI (JP)
HIROTA YOSHIHITO (JP)

Application Number:

PCT/JP2023/028788

Publication Date:

February 22, 2024

Filing Date:

August 07, 2023

Export Citation:

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Assignee:

MITSUI CHEMICALS INC (JP)

International Classes:

C08L53/02; B32B27/32; C08F8/46; C08L45/00; C09J7/30; C09J11/08; C09J201/00

Foreign References:

JP2007302722A	2007-11-22
JP2018039995A	2018-03-15

Attorney, Agent or Firm:

IKUMI PATENT ATTORNEYS OFFICE (JP)

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