Title:
LOW-MELTING-POINT COMPOSITION, SEALANT, AND SEALING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/154956
Kind Code:
A1
Abstract:
Disclosed is a low-melting-point composition with which it is possible to seal an object to be sealed by applying the composition to the object to be sealed, and then cooling and solidifying after heat-treating in a temperature range of 250°C or lower in air. This composition is a low-melting-point composition comprising Ag, Ge, I, and O as essential constituent elements, wherein when represented as an aggregate of various compounds shown by the formula MQm/q (in the formula, M is a cation of valence m and Q is an anion of valence q) obtained by bonding a cation and anion with all anions other than oxide ions (O2-) bonded with Ag ions, the proportions of these compounds satisfy the following conditions. AgI: 10-60 mol%, AgO1/2: 25-60 mol%, GeO2: 10-30 mol%, ΣAgQ1/q: 70-85 mol%, ΣMOm/2: 40-90 mol%, and (ΣMOm/2-AgO1/2)/AgO1/2: 0.37-0.60 (mol/mol).
Inventors:
IKEDA TAKURO (JP)
Application Number:
PCT/JP2017/009168
Publication Date:
September 14, 2017
Filing Date:
March 08, 2017
Export Citation:
Assignee:
NIHON YAMAMURA GLASS CO LTD (JP)
International Classes:
C03C8/02; C03C8/16
Foreign References:
JPS55108104A | 1980-08-19 | |||
JPH05147974A | 1993-06-15 |
Other References:
HIDEKI MORIKAWA ET AL.: "An EXAFS Study of Coordination of Ag in AgI-Ag2O-GeO2 Glasses", JOURNAL OF THE CERAMIC ASSOCIATION, vol. 95, no. 5, 1987, Japan, pages 551 - 555, ISSN: 1884-2127
Attorney, Agent or Firm:
HAYASAKA, Takumi (JP)
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