Title:
LOW MELTING POINT SEALING MATERIAL AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/131190
Kind Code:
A1
Abstract:
Provided is a sealing material applicable to a surface comprising an inorganic oxide and/or metal, that can be well spread after heat treatment in a low temperature range, and can be satisfactorily sealed by cooling and solidification. This sealing material is a low melting point sealing material comprising 50%–100% by volume of a low melting point composition and 0%–50% by volume of a filler. The low melting point composition includes at least either Te or V and includes Ag, I, and O as essential constituent elements thereof, comprises bonded cations and anions, and when represented as an aggregation of various compounds indicated by formula MQm/q [M indicates a cation having a valency m and Q indicates an anion having a valency q] and when all anions other than oxide ions (O2–) are represented as being bonded with Ag ions, the ratios of these compounds fulfill the following conditions: AgI: 0.1–71 mol%, AgO1/2: 19–72 mol%, TeO2 + VO5/2: 10–55 mol%, and AgO1/2 + AgI: 45–90 mol%.
More Like This:
| JP2018131339 | OPTICAL CAP COMPONENT |
| JPH1196913 | SEAL GLASS PASTE |
| JP3534257 | PRODUCTION OF FILLER POWDER |
Inventors:
IKEDA TAKURO (JP)
Application Number:
PCT/JP2017/024433
Publication Date:
July 19, 2018
Filing Date:
July 04, 2017
Export Citation:
Assignee:
NIHON YAMAMURA GLASS CO LTD (JP)
International Classes:
C03C8/24; C03C3/23; C03C8/08
Foreign References:
| JP2001328837A | 2001-11-27 | |||
| JP2002037644A | 2002-02-06 | |||
| JP2005132650A | 2005-05-26 |
Attorney, Agent or Firm:
HAYASAKA, Takumi (JP)
Download PDF: