LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION OF CONDUCTIVE ELECTRONIC FEATURES

WIPO Patent Application WO2003032084

A3

Abstract A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features. Another particularly preferred precursor composition includes copper metal for the formation of highly conductive copper features.

JP2595276	[Title of the Invention] A pad-shaped material having cushioning properties for a package, a method for manufacturing the same, and a manufacturing apparatus thereof.
JP7317203	SELF-HEALING OR REPEATABLE PRODUCTS, PRODUCTION METHOD AND APPLICATION THEREOF

KODAS TOIVO T
HAMPDEN-SMITH MARK J
ATANASSOVA PAOLINA
KUNZE KLAUS
VANHEUSDEN KAREL
DENHAM HUGH
STUMP AARON
SCHULT ALLEN

PCT/US2002/031884

August 21, 2003

October 04, 2002

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SUPERIOR MICROPOWDERS LLC (US)

B05D3/02; B05D5/12; B22F9/30; B41M5/50; B41M5/00; B41M5/52; C09D11/00; C23C18/06; C23C18/08; C23C20/04; H01B1/02; H01L21/28; H01L21/288; H01L21/316; H01L21/3205; H05K1/16; H05K3/10; H01L21/314; H05K1/03; H05K1/09; H05K3/12; H05K3/40; (IPC1-7): C09D11/00; H05K1/09; H01B1/02; B05D5/06

US6143356A	2000-11-07
US6197366B1	2001-03-06
US4170480A	1979-10-09
US4622069A	1986-11-11
EP0696515A1	1996-02-14
JPS63278983A	1988-11-16
JP2000011875A	2000-01-14

See also references of EP 1448725A4

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