Title:
MAGNETIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/141669
Kind Code:
A1
Abstract:
This magnetic device (1) is provided with the following: a magnetic core (2a, 2b); an insulating substrate (3) that has a plurality of layers (L1 through L3); conductive coil patterns (4a through 4e) provided on each layer (L1 through L3) so as to wind around the core (2a); conductive heat-dissipating patterns (5a1 through 5a9, 5b1 through 5b9) provided on each layer (L1 through L3); and heat-dissipating pins (7a through 7f) that connect patterns (4a through 4d, 5a7 through 5a9, 5b7 through 5b9) on different layers (L1 through L3). Said heat-dissipating pins (7a through 7f) pass through the substrate (3). On each layer (L1 through L3), through-holes (8d) and pads (8c) are provided between the heat-dissipating pins (7a through 7f) and patterns (4a through 4d, 5a7 through 5a9, 5b7 through 5b9) connected thereto, whereas insulating regions (A8 through A10) are provided between the insulating pins (7a through 7f) and patterns (4a through 4e, 5a1 through 5a9, 5b1 through 5b9) not connected thereto.
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Inventors:
HACHIYA KOJI (JP)
KOBAYASHI TOMOYOSHI (JP)
NAKABAYASHI KOICHI (JP)
KOBAYASHI TOMOYOSHI (JP)
NAKABAYASHI KOICHI (JP)
Application Number:
PCT/JP2014/001321
Publication Date:
September 18, 2014
Filing Date:
March 10, 2014
Export Citation:
Assignee:
OMRON AUTOMOTIVE ELECTRONICS (JP)
International Classes:
H01F37/00; H01F17/00; H01F17/04; H01F27/08; H01F27/22; H01F27/28; H05K1/02
Domestic Patent References:
| WO2011010491A1 | 2011-01-27 |
Foreign References:
| JP2007059839A | 2007-03-08 | |||
| JP2010161258A | 2010-07-22 | |||
| JP2010153724A | 2010-07-08 | |||
| JP2008502293A | 2008-01-24 | |||
| JP2013062355A | 2013-04-04 |
Attorney, Agent or Firm:
OKUMURA, HIDEYUKI (JP)
Hideyuki Okumura (JP)
Hideyuki Okumura (JP)
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