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Title:
MAGNETIC POWDER, COMPOUND, MOLDED BODY, BONDED MAGNET, AND POWDER MAGNETIC CORE
Document Type and Number:
WIPO Patent Application WO/2022/220295
Kind Code:
A1
Abstract:
This magnetic powder includes: a plurality of magnetic particles comprising at least one of a permanent magnet and a soft magnetic body; a first silicon compound that covers at least a portion of the surface of the magnetic particles; and a second silicon compound that covers at least a portion of the surface of the magnetic particles. The first silicon compound includes an alkyl group and silicon bonded to the alkyl group. The second silicon compound includes an alkyl chain, silicon bonded to one end of the alkyl chain, and a glycidyl group located at the other end of the alkyl chain. The number m of carbons of the alkyl chain included in the second silicon compound is greater than the number n of carbons of the alkyl group included in the first silicon compound.

Inventors:
TAKEUCHI KAZUMASA (JP)
TAIRA ARISA (JP)
ITOH TERUO (JP)
MAEDA HIDEO (JP)
ISHIHARA CHIO (JP)
Application Number:
PCT/JP2022/017908
Publication Date:
October 20, 2022
Filing Date:
April 15, 2022
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B22F1/102; B22F1/00; B22F3/00; C08L101/00; H01F1/055; H01F1/057; H01F1/06; H01F1/26; H01F27/255
Domestic Patent References:
WO2019167182A12019-09-06
WO2018131536A12018-07-19
Foreign References:
JP2003142307A2003-05-16
JPH01301709A1989-12-05
JP2018120966A2018-08-02
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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