Title:
MANUFACTURING FIRE RETARDANT CIRCUIT BOARDS WITHOUT THE USE OF FIRE RETARDANT RESIN ADDITIVES
Document Type and Number:
WIPO Patent Application WO2002021886
Kind Code:
A3
Abstract:
This invention relates to printed circuit boards having improved fire resistance and improved environmental stability. The invention provides halogen-free fire retardant printed circuit boards incorporating potentially flammable polymers. Flame resistant thermoplastic layers prevent combustion of thermosetting polymers, as well as adding strength to the laminate, resulting in a less brittle thin core than the prior art. The flame resistant circuit board is cost efficient, environmentally safe and has excellent properties, including a decreased probability of shorting, good dielectric breakdown voltage, a smooth surface and good electrical/thermal performance.
Inventors:
ANDRESAKIS JOHN A
PATUREL DAVE
PATUREL DAVE
Application Number:
PCT/US2001/025363
Publication Date:
June 20, 2002
Filing Date:
August 13, 2001
Export Citation:
Assignee:
OAK MITSUI INC (US)
International Classes:
B32B15/08; H05K1/03; (IPC1-7): H05K1/03; B32B27/08
Foreign References:
| US5707749A | 1998-01-13 | |||
| GB2057351A | 1981-04-01 | |||
| US3527665A | 1970-09-08 | |||
| DE19952246A1 | 2000-05-31 |
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